iCE40 Ultra Family

An ultra-low power FPGA and sensor management from Lattice Semiconductor called the iCE40 Ultra series is made for ultra-low power mobile applications, including those found in smartphones, tablets, and handheld devices. Almost all mobile sensors and application processors can be interfaced with using the integrated SPI and I2C blocks found in the iCE40 Ultra family. Additionally, the iCE40 Ultra series has two on-chip oscillators that operate at 10 kHz and 48 MHz. The HFOSC (48 MHz) can be used for wakeup activities, while the LFOSC (10 kHz) is best for low power operation in always-on applications. Additionally, the iCE40 Ultra family has a DSP functional block to off-load the application processor's processing of the data coming from mobile sensors. Without the use of an additional MOSFET or buffer, the integrated RGB PWM IP and the iCE40 Ultra's three 24 mA constant current RGB outputs offer all the logic required to control the service LED directly. For applications like IrDA functionality, the 500 mA constant current IR driver output offers a direct interface to external LEDs. Without the use of an additional MOSFET or buffer, users can easily construct the modulation logic that best suits their needs and connect the IR driver directly to the LED. As a Barcode Emulation device, this high current IR driver may transmit barcode data to an external Barcode Reader. Devices of the iCE40 Ultra family are intended for mobile apps to carry out custom functions such IrDA, Service LED, Barcode Emulation, GPIO Expander, and SDIO Level Shift. 

Features

 Flexible Logic Architecture

 Three devices with 1100 to 3520 LUTs

 Offered in WLCS, ucfBGA and QFN packages

 Ultra-low Power Devices

 Advanced 40 nm ultra-low power process

 As low as 71 µA standby current typical

 Embedded Memory

 Up to 80 kbits sysMEM Embedded BlockRAM

 Two Hardened I2C Interfaces

 Two Hardened SPI Interfaces

 Two On-Chip Oscillators

 Low Frequency Oscillator – 10 kHz

 High Frequency Oscillator – 48 MHz

 24 mA Current Drive RGB LED Outputs

 Three drive outputs in each device

 User selectable sink current up to 24 mA

 500 mA Current Drive IR LED Output

 One IR drive output in each device

 User selectable sink current up to 500 mA

 On-chip DSP

 Signed and unsigned 8-bit or 16-bit functions

 Functions include Multiplier, Accumulator, andMultiply-Accumulate (MAC)

 Flexible On-Chip Clocking

 Eight low skew global signal resource, six canbe directly driven from external pins

 One PLL with dynamic interface per device

 Flexible Device Configuration

 SRAM is configured through:

 Standard SPI Interface

 Internal Nonvolatile ConfigurationMemory (NVCM)

 Ultra-Small Form Factor

 As small as 2.078 mm x 2.078 mm

 Applications

 Smartphones

 Tablets and Consumer Handheld Devices

 Handheld Commercial and Industrial Devices

 Multi Sensor Management Applications

 Sensor Pre-processing and Sensor Fusion

 Always-On Sensor Applications

 USB 3.1 Type C Cable Detect/Power Delivery Applications