iCE40 UltraPlus Family

An ultra-low power FPGA and sensor management from Lattice Semiconductor called the iCE40 UltraPlus series is made for ultra-low power mobile applications, including those found in smartphones, tablets, and handheld devices. With the exception of the high-current IR LED driver, the iCE40 UltraPlus is compatible with Lattice's iCE40 Ultra family of devices. The iCE40 UltraPlus also includes an extra 1 Mb SRAM, more DSP blocks, and more LUTs, all of which can be used to offer an always-on voice recognition function in mobile devices without the need to constantly run the more power-hungry voice codec. SPI and I2C blocks that are built into the iCE40 UltraPlus series allow it to interface with almost all mobile sensors and application processors. Two I/O pins of the iCE40 UltraPlus series are also available to support the interface to I3C devices. There are two on-chip oscillators: one is the HFOSC (48 MHz), which can be utilized for wakeup activities, and the other is the LFOSC (10 kHz), which is suited for low power operation in always-on applications. Additionally, the iCE40 UltraPlus family includes a DSP functional block to off-load the Application Processor's processing of data provided from the mobile device, such as voice data. The iCE40 UltraPlus's RGB PWM IP, which has three 24 mA constant current RGB outputs, contains all the circuitry required to drive the service LED directly without the use of an additional MOSFET or buffer. The iCE40 UltraPlus line of products is designed to enable mobile apps to carry out all the tasks that can be carried out by iCE40 Ultra devices, including Service LED, GPIO Expander, SDIO Level Shift, and other specialized features. Additionally, voice recognition applications are targeted for the iCE40 UltraPlus family of devices. Two device densities, 2800 to 5280 Look Up Tables (LUTs) of logic with programmable I/Os that can be utilized as either SPI/I2C interface ports or general purpose I/Os, are available in the iCE40 UltraPlus family. A higher performance I3C interface can be used with two of the iCE40 UltraPlus I/Os. Additionally, it features 1024 kb of Single Port SRAMs for user logic and up to 120 kb of Block RAMs.

Functional

The architecture of the iCE40 UltraPlus family includes a number of Programmable Logic Blocks (PLB), two Oscillator Generators, two user-configurable I2 C controllers, two user-configurable SPI controllers, blocks of sysMEM Embedded Block RAM (EBR), and Single Port RAM (SPRAM), all encircled by Programmable I/O (PIO). The iCE40UP5K device's block diagram is displayed in Figure 3.1.The SysMEM EBR blocks and Programmable Logic Blocks (PLB) are placed in a two-dimensional grid with rows and columns. There are either PLB or EBR blocks in every column. The PIO cells are stacked in banks and are found at the top and bottom of the device. The foundational elements for logic, arithmetic, and register functions are found in the PLB. A flexible I/O buffer used by the PIOs is known as a sysIO buffer, and it allows for operation with a number of different interface standards. Numerous vertical and horizontal routing channel resources connect the blocks. These routing resources are automatically distributed using the put and route software program. There are three sysIO banks in the iCE40 UltraPlus family: one on top and two at the bottom. If all the I/Os use the same voltage standard, the user can link a few VCCIOs together. See the section on Power-up Supply Sequence. The sysMEM EBRs are huge, fast memory blocks with a 4 kb size. Using PLBs, these blocks can be set up as RAM, ROM, or FIFO with user logic. The iCE40 UltraPlus devices also have four 256 kb SPRAM blocks that can be cascaded to form up to 1 Mb blocks in addition to the EBR. It is helpful for the short-term storing of massive amounts of data.

Features

 Flexible Logic Architecture

 Two devices with 2800 to 5280 LUTs

 Offered in WLCS and QFN packages

 Ultra-low Power Devices

 Advanced 40 nm low power process

 As low as 100 µA standby current typical

 Embedded Memory

 Up to 1024 kb Single Port SRAM

 Up to 120 kb sysMEM Embedded Block RAM

 Two Hardened I2C Interfaces

 Two I/O pins to support I3C interface

 Two Hardened SPI Interfaces

 Two On-Chip Oscillators

 Low Frequency Oscillator – 10 kHz

 High Frequency Oscillator – 48 MHz

 24 mA Current Drive RGB LED Outputs

 Three drive outputs in each device

 User selectable sink current up to 24 mA

 On-chip DSP

 Signed and unsigned 8-bit or 16-bit functions

 Functions include Multiplier, Accumulator, and

  Multiply-Accumulate (MAC)

 Flexible On-Chip Clocking

 Eight low skew global signal resource, six can be directly driven from external pins

 One PLL with dynamic interface per device

 Flexible Device Configuration

 SRAM is configured through:

 Standard SPI Interface

 Internal Nonvolatile Configuration Memory (NVCM)

 Ultra-Small Form Factor

 As small as 2.11 mm × 2.54 mm

 Applications

 Always-On Voice Recognition Application

 Smartphones

 Tablets and Consumer Handheld Devices

 Handheld Commercial and Industrial Devices

 Multi Sensor Management Applications

 Sensor Pre-processing and Sensor Fusion

 Always-On Sensor Applications

 USB 3.1 Type C Cable Detect / Power Delivery Applications