SPI and I2C blocks are built into the ICE40UP5K-SG48I to interact with almost all mobile sensors and application processors. Two I/O pins of the iCE40 UltraPlus series are also available to support the interface to I3C devices. There are two on-chip oscillators: one is the HFOSC (48 MHz), which can be utilized for wakeup activities, and the other is the LFOSC (10 kHz), which is suited for low power operation in always-on applications.
Additionally, ICE40UP5K-SG48I has a DSP functional block to off-load an application processor that pre-processes data sent from a mobile device, like speech data. The iCE40 UltraPlus's RGB PWM IP, which has three 24 mA constant current RGB outputs, contains all the circuitry required to drive the service LED directly without the use of an additional MOSFET or buffer. This ICE40UP5K-SG48I is intended to enable mobile applications to carry out all the tasks that the iCE40 Ultra devices can, including Service LED, GPIO Expander, SDIO Level Shift, and other specialized features. Additionally, voice recognition applications are targeted for the iCE40 UltraPlus family of devices.
Two device densities, 2800 to 5280 Look Up Tables (LUTs) of logic with programmable I/Os that can be utilized as either SPI/I2C interface ports or general purpose I/Os, are available in the iCE40 UltraPlus family. Interfaces to I3C with higher performance can be created using two of the iCE40 UltraPlus I/Os. Additionally, it features 1024 kb of Single Port SRAMs for user logic and up to 120 kb of Block RAMs.
Flexible Logic Architecture
· Two devices with 2800 to 5280 LUTs
· Offered in WLCS and QFN packages
· Ultra-low Power Devices
· Advanced 40 nm low power process
· As low as 100 µA standby current typical
· Embedded Memory
· Up to 1024 kb Single Port SRAM
· Up to 120 kb sysMEM™ Embedded Block RAM
· Two Hardened I2C Interfaces
· Two I/O pins to support I3C interface
· Two Hardened SPI Interfaces
· Two On-Chip Oscillators
· Low Frequency Oscillator – 10 kHz
· High Frequency Oscillator – 48 MHz
· 24 mA Current Drive RGB LED Outputs
· Three drive outputs in each device
· User selectable sink current up to 24 mA
· On-chip DSP
· Signed and unsigned 8-bit or 16-bit functions
· Functions include Multiplier, Accumulator, and
Multiply-Accumulate (MAC)
· Flexible On-Chip Clocking
· Eight low skew global signal resource, six can
be directly driven from external pins
· One PLL with dynamic interface per device
· Flexible Device Configuration
· SRAM is configured through:
· Standard SPI Interface
· Internal Nonvolatile Configuration Memory
(NVCM)
· Ultra-Small Form Factor
· As small as 2.11 mm × 2.54 mm
Smartphones, tablets, consumer handheld devices, always-on voice recognition applications, and handheld commercial and industrial devices
Applications for Multiple Sensor Management
Sensor Fusion and Pre-processing
Constantly Running Sensor Applications
Applications for USB 3.1 Type C Cable Detection and Power Delivery
Specification | Value |
---|---|
Number of LABs/CLBs | 660 |
Number of Logic Elements/Cells | 5280 |
Total RAM Bits | 1171456 |
Number of I/O | 39 |
Voltage - Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | -40℃ ~ 100℃ (TJ) |
Package / Case | 48-VFQFN Exposed Pad |
Supplier Device Package | 48-QFN (7x7) |
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