VEMEKOLogo
VEMEKOLogo
FPGA
All MCU FPGA DSP SoC Microprocessor
Home > Blog > FPGA

Actel FPGA Packaging and Selection Guide

Time: 2025-04-09 11:29:46View:

1. Overview of Actel FPGAs (Now Microsemi/Microchip FPGA)

Actel (now part of Microchip Technology) specializes in low-power, flash-based FPGAs with high reliability, making them ideal for aerospace, defense, medical, and industrial applications.


polarfire-soc-fpga-icicle-risc-v-fpga-board-scaled.jpg


Key Series:

  • ProASIC3 – Low-power, flash-based FPGAs

  • IGLOO – Ultra-low power for portable/battery-operated devices

  • Fusion – Mixed-signal FPGAs (with analog components)

  • SmartFusion/2 – FPGA + ARM Cortex-M3/M4 (SoC solutions)


2. Actel FPGA Packaging Options

Actel FPGAs come in various packages, optimized for different applications:

Package TypeDescriptionCommon Use Cases
QFN (Quad Flat No-lead)Compact, low-profile, good thermal performancePortable devices, space-constrained designs
TQFP (Thin Quad Flat Pack)Standard leaded package, easy prototypingIndustrial, automotive
BGA (Ball Grid Array)High pin count, better signal integrityHigh-performance computing, networking
CSBGA (Chip-Scale BGA)Ultra-small, minimal footprintWearables, medical implants
PQFP (Plastic Quad Flat Pack)Cost-effective, moderate pin countConsumer electronics


Key Considerations for Package Selection:

  • Size & PCB Space → CSBGA/QFN for compact designs, BGA for high-density layouts.

  • Thermal Performance → BGA/QFN for better heat dissipation.

  • Manufacturing Complexity → TQFP/PQFP for easier hand assembly, BGA requires reflow soldering.

  • Signal Integrity → BGA is best for high-speed designs.


3. How to Select the Right Actel FPGA

a. Define Requirements:

    • Power Consumption → IGLOO for ultra-low power, ProASIC3 for balanced performance.

    • Logic Density (LUTs, Gates) → Choose based on design complexity.

    • I/O Requirements → Check voltage levels (1.2V, 1.5V, 1.8V, 2.5V, 3.3V).

    • Special Features → Fusion for analog, SmartFusion for ARM + FPGA.


b. Package Selection:

    • Portable/Wearable → CSBGA or QFN (smallest size).

    • Industrial/Automotive → TQFP or BGA (rugged, high reliability).

    • High-Speed Designs → BGA (best signal integrity).


c. Development Tools & Ecosystem:

    • Libero IDE (Microchip’s official FPGA design suite).

    • SoftConsole (for ARM-based SmartFusion FPGAs).

    • Third-party tool support (Synopsys, Mentor Graphics).


4. Recommended Actel FPGA Families & Typical Packages

FPGA FamilyBest ForCommon Packages
IGLOOUltra-low power (battery-operated)QFN, CSBGA
ProASIC3General-purpose, low powerTQFP, BGA
FusionMixed-signal (ADC, PWM)TQFP, BGA
SmartFusion2FPGA + ARM Cortex-M3/M4BGA, TQFP


5. Where to Buy & Resources

  • Official Distributors: Microchip Direct, Digi-Key, Mouser, Vemeko.

  • Datasheets & User Guides: Microchip FPGA Page

  • Development Kits:

    • IGLOO Nano (Low-cost evaluation)

    • SmartFusion2 Evaluation Kit (ARM + FPGA)



Actel (Microchip) FPGA Selection & Recommendations Guide

1. Quick Selection by Application

ApplicationBest SeriesRecommended ModelPackageKey Features
Ultra-Low-Power (IoT, Sensors)IGLOO NanoAGLN250V2-QN68QFN-680.03 mW/MHz, 32 MHz Cortex-M1
Motor Control (Industrial)ProASIC3A3P250-PQG208TQFP-208250k Gates, 1.5V-3.3V I/O
Medical DevicesFusionAFS600-FGG256BGA-256Integrated ADC/PWM
5G/CommunicationsSmartFusion2M2S010-FGG484BGA-484Dual-Core ARM Cortex-M3
Military/AerospaceRT ProASIC3RTAX4000S-CG352BGA-352Radiation-Hardened

2. Detailed Selection Guide

Step 1: Define Core Parameters

  • Power Consumption:

    • < 1 mW → IGLOO Nano (e.g., AGL030V5-VQ80)

    • Medium → ProASIC3E (e.g., A3PE600-FGG400)

  • Logic Density:

    • 10k-100k Gates → IGLOO (AGLxxx)

    • 100k-1M Gates → ProASIC3 (A3Pxxx)

    • 1M Gates → SmartFusion2 (M2Sxxx)


Step 2: Special Features

  • Analog Interfaces: → Fusion Series (AFS600)

  • Security: → SmartFusion2 with Crypto-Core

  • Extreme Environments: → RT ProASIC3 (up to 175°C)


Step 3: Package Selection

  • Hand Prototyping: TQFP-144 (easy assembly)

  • High Frequency: BGA-484 (better signal integrity)

  • Miniaturized: CSBGA-81 (3.5×3.5 mm)


3. Development Tools

  • Libero IDE (Free version for small FPGAs)

  • FlashPro Programmer (for all flash-based FPGAs)

  • Example Projects: GitHub "Microsemi-FPGA-Examples"


4. Current Availability (2024)

  • IGLOO Nano: In stock at Vemeko (from €4.50/unit)

  • SmartFusion2: 12-week lead time (chip shortage)


Conclusion

  • For low power & small size → IGLOO (QFN/CSBGA)

  • For mixed-signal designs → Fusion (TQFP/BGA)

  • For ARM + FPGA integration → SmartFusion2 (BGA)

  • For cost-sensitive industrial apps → ProASIC3 (TQFP)