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M2GL050-1FGG896I

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M2GL050-1FGG896I

Manufacturer:
Microsemi
Package/Case:
FBGA-896
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
FPGA IGLOO2 Family 56340 Cells 1.2V 896-Pin FBGA Tray
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M2GL050-1FGG896I Overview

The M2GL050-1FGG896I offers a differentiated, cost- and power-optimized architecture that includes a 4-input look-up table (LUT) based fabric, 5G transceivers, high-speed general-purpose I/O (GPIO), block RAM, and digital signal processing (DSP) blocks. In comparison to other products in its class, this next-generation M2GL050-1FGG896I architecture combines a non-volatile flash-based fabric with the highest number of GPIO, 5G serialization/deserialization (SERDES) interfaces and PCI Express endpoints. It also offers up to 5x more logic density and 3x more fabric performance than its predecessors.

The M2GL050-1FGG896I architecture is a highly differentiated and cost-optimized solution that offers a range of advanced features. With its powerful combination of GPIO, block RAM, and DSP blocks, this architecture delivers exceptional performance and efficiency. The non-volatile flash-based fabric provides unparalleled reliability and security, while the high number of GPIO, SERDES interfaces, and PCIe endpoints make it one of the most versatile products in its class. Whether you are looking for a high-performance solution for data processing or a low-power solution for embedded applications, the M2GL050-1FGG896I architecture has everything you need to succeed. With up to 5x more logic density and 3x more fabric performance than its predecessors, this next-generation architecture is truly a game-changer in the world of FPGAs.

M2GL050-1FGG896I Specifications

Specification Value
Number of Logic Elements/Cells 56340
Total RAM Bits 1869824
Number of I/O 377
Voltage - Supply 1.14V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40℃ ~ 100℃ (TJ)
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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