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M2S090T-1FG676I

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M2S090T-1FG676I

Manufacturer:
Microsemi
Package/Case:
FBGA-676
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
Product Categories:
Embedded - System On Chip (SoC)
Description:
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 676-Pin FBGA Tray
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M2S090T-1FG676I Overview

A 4-input lookup table-based (LUT) FPGA fabric with integrated math blocks, numerous embedded memory blocks, and high-performance SerDes communication interfaces are integrated on a single chip by this M2S090T-1FG676I device. Both generations are the most secure and dependable FPGAs in the market and benefit from low-power flash technology.

These newer products have integrated hard DDR3 memory controllers with error correction, up to 150K Logic Elements, up to 5 MBs of embedded RAM, up to 16 SerDes lanes, and up to four PCI Express Gen 2 endpoints. M2S090T-1FG676I integrates an entire low-power, real-time microcontroller subsystem (MSS) with a rich set of industry-standard peripherals including Ethernet, USB, and CAN, while IGLOO2 devices integrate a high-performance memory subsystem with on-chip flash, 32 Kbyte embedded SRAM, and multiple DMA controllers.

 

M2S090T-1FG676I Features

  • Arm® Cortex®-M3 processor with embedded Flash

  • Comprehensive microcontroller subsystem

  • PCIe® Gen 2 support in 10K Logic Elements (LEs)

  • Lowest power

  • Reduce total power by ~20–40%

  • Proven security

  • Protection from overbuilding and cloning

  • Secure boot for FPGA and processors

  • Exceptional reliability

  • Single Event Upset (SEU) immune, zero Failure-in-Time (FIT) Flash FPGA configuration

  • Excellent option for safety-critical and mission-critical systems

 

M2S090T-1FG676I Applications

  • Communications

  • Defense

  • Industrial

  • Advanced Driver Assist Systems (ADAS)

  • Industrial motor control

  • Industrial networking

  • Machine vision


M2S090T-1FG676I Specifications

TypeDescription
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrMicrochip Technology
SeriesSmartFusion®2
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorARM® Cortex®-M3
Flash Size512KB
RAM Size64KB
PeripheralsDDR, PCIe, SERDES
ConnectivityCANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed166MHz
Primary AttributesFPGA - 90K Logic Modules
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)
Number of I/O425
Base Product NumberM2S090


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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