1SX280LN3F43I3VG offers the best system integration and performance. Learn more about the novel benefits and unique features that 1SX280LN3F43I3VG provides to support next-generation, high-performance systems in a range of applications in the sections below. This device is designed to meet the high performance demands of high-throughput systems. 1SX280LN3F43I3VG has transceiver capabilities of up to 28.3 Gbps for chip-to-chip and backplane applications and floating-point performance of up to 10 TFLOPS.
High-bandwidth memory 2 (3D stacked) and the programmability and flexibility of Stratix 10 FPGAs and SoCs are combined in a single package as 1SX280LN3F43I3VG. 1SX280LN3F43I3VG offers support for H- and E-transceiver tiles. This part is the first FPGA to provide Ultra Path Interconnect (UPI), enabling direct coherent connectivity to future selected Xeon Scalable processors. 1SX280LN3F43I3VG has a new memory controller that supports certain Optane DC permanent memory in addition to a PCIe* Gen4 interface that can be configured up to x16 for 16 GT/s. a high bandwidth, low latency FPGA designed for artificial intelligence (AI) applications.
|Quad ARM? Cortex?-A53 MPCore? with CoreSight?
|EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
|FPGA - 2800K Logic Elements
|-40℃ ~ 100℃ (TJ)
|Package / Case
|Supplier Device Package
|1760-FBGA, FC (42.5x42.5)
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