The hardware and software required to create entire FPGA designs and test them in a system environment are all included in 5AGTFD3H3F35I3G component, which offers a complete design environment. The following functionalities are included in the development kit: three I/O expansion slots, two high-speed mezzanine cards (HSMCs), one FPGA mezzanine card (FMC), 504K logic elements (LEs), an F1517 package, 36 6G transceivers, two FPGAs for system-level design, two GB of DDR3 SDRAM memory, 4.5 MB of QDR II+ memory, and 1 Gb of flash memory. SMAs, the new Samtec Bull's Eye connector, two SFP+ connections, and the capacity to gauge each chip's independent power rails are all included.
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 17110 |
| Number of Logic Elements/Cells | 362000 |
| Total RAM Bits | 19822592 |
| Number of I/O | 544 |
| Voltage - Supply | 1.12V ~ 1.18V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
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