For high volume, budget-conscious applications, this EP2C70F672C8NK offers a customer-defined feature set and are designed from the ground up to be inexpensive. At a price comparable to ASICs, EP2C70F672C8NK offers high performance and low power consumption. Cyclone II FPGAs have up to 622 useable I/O pins and up to 1.1Mbits of integrated memory, bringing the low-cost FPGA density range to 68,416 Logic Elements (LEs).
To ensure quick availability and cheap cost, these FPGAs are produced on 300mm wafers utilizing TSMC's 90nm low-k dielectric technology. EP2C70F672C8NK can enable complex digital systems on a single chip at a cost comparable to ASICs by reducing silicon area. Compared to competitor 90nm FPGAs, this device provides a 60% increase in performance and a 50% reduction in power usage. Cyclone II FPGAs are the best options for a wide range of automotive, consumer, communications, video processing, test and measurement, and other end-market solutions due to their low cost and optimized feature set.
| Specification | Value |
|---|---|
| Series | Cyclone II |
| Number of Logic Blocks | 4276 |
| Embedded Block RAM - EBR | 1152 kbit |
| Number of I/Os | 422 |
| Operating Supply Voltage | 1.15 V to 1.25 V |
| Maximum Operating Temperature | + 70 C |
| Mounting Style | SMD/SMT |
| Package / Case | FBGA-672 |
| Distributed RAM | 1.1 Mbit |
| Minimum Operating Temperature | 0 C |
| Packaging | Tray |
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