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Home > Product > Lattice Semiconductor > LatticeECP3 Family
LFE3-70EA-7LFN1156C

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LFE3-70EA-7LFN1156C

Manufacturer:
Lattice
Package/Case:
FBGA-1156
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
Product Categories:
Programmable Logic ICs
Description:
FPGA LatticeECP3 Family 67000 Cells 65nm Technology 1.2V 1156-Pin FBGA Tray
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LFE3-70EA-7LFN1156C Overview

LFE3-70EA-7LFN1156C is the top-performing mid-range FPGA in its class, featuring high-performance SERDES, fully functional DSP blocks, and support for cutting-edge memory interfaces like DDR3. Compared to rivals, it provides 35% to 100% more silicon resources in smaller packages. Applications for low-power LFE3-70EA-7LFN1156C include consumer electronics, computers, storage, medical equipment, video processing, security and surveillance, industrial networking, and industrial automation. For system integration, LFE3-70EA-7LFN1156C provides up to 7 Mbits of memory and 150K LUTs of logic capacity. They also provide cascadable high-performance DSP blocks for signal processing, DDR3 at 800 Mbps high-speed memory interfaces, and up to 1 Gbps LVDS performance for ADC/DAC and SPI4.2 interfaces. With proven 3.2 Gbps low-power SERDES qualified for a number of protocols, including PCI Express 1.1, Ethernet (GbE, SGMII & XAUI), SMPTE SDI (3G/HD/SD), Serial RapidIO 2.1, low-latency CPRI, and JESD204A, LFE3-70EA-7LFN1156C also makes it possible to design high-speed systems.Lattice also provides a variety of general and application-specific development kits, an ever-expanding selection of free premade reference designs, and a number of affordable IP suites to speed up the design ofLFE3-70EA-7LFN1156C powered systems.

LFE3-70EA-7LFN1156C Specifications

Specification Value
Category Integrated Circuits (ICs)
Mounting Type Surface Mount
Number of I/O 490
Number of LABs/CLBs 8375
Number of Logic Elements/Cells 67000
Operating Temperature 0掳C ~ 85掳C
Package / Case 1156-BBGA
Series ECP3
Standard Package 24
Supplier Device Package 1156-FPBGA (35x35)
Total RAM Bits 4526080
Voltage - Supply 1.14 V ~ 1.26 V

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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