The target design platform's programmable chip basis, the XA6SLX16-3FTG256I, offers integrated software and hardware components that let designers concentrate on innovation right away at the start of the development cycle. These features offer a programmable, low-cost substitute for custom ASIC devices with unmatched usability. The ideal option for a versatile and scalable large-capacity logic architecture that needs to support numerous interface standards, a high-bandwidth parallel DSP processing design, and budget-conscious applications is the XA6SLX16-3FTG256I. Strict automotive device-level specifications are reached by the XA6SLX16-3FTG256I, which is produced utilizing well-known low power consumption 45nm, 9 metal copper layer, double oxidation treatment technology.
| Specification | Value |
|---|---|
| Number of LABs/CLBs | 1139 |
| Number of Logic Elements/Cells | 14579 |
| Total RAM Bits | 589824 |
| Number of I/O | 186 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40℃ ~ 100℃ (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
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