The target design platform's programmable chip basis, the XA6SLX75T-3FGG484I, offers integrated software and hardware components that let designers concentrate on innovation right away at the start of the development cycle. These features offer a programmable, low-cost substitute for custom ASIC devices with unmatched usability. The ideal option for a versatile and scalable large-capacity logic architecture that needs to support numerous interface standards, a high-bandwidth parallel DSP processing design, and budget-conscious applications is the XA6SLX75T-3FGG484I. Strict automotive device-level specifications are reached by the XA6SLX75T-3FGG484I, which is produced utilizing well-known low power consumption 45nm, 9 metal copper layer, double oxidation treatment technology.
Specification | Value |
---|---|
Number of LABs/CLBs | 5831 |
Number of Logic Elements/Cells | 74637 |
Total RAM Bits | 3170304 |
Number of I/O | 268 |
Voltage - Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | -40℃ ~ 100℃ (TJ) |
Package / Case | 484-BBGA |
Supplier Device Package | 484-FBGA (23x23) |
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