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Home > Product > Xilinx, Inc > Spartan-3AN FPGA Family
XC3S700AN-4FGG484C

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XC3S700AN-4FGG484C

Manufacturer:
Xilinx
Package/Case:
FBGA-484
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
FPGA Spartan-3AN Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V Automotive Medical 484-Pin FBGA
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XC3S700AN-4FGG484C Overview

The XC3S700AN-4FGG484C combines nonvolatile technology with the best attributes of a state-of-the-art, affordable FPGA. Modern in-system Flash memory is coupled with all of the Spartan-3A FPGA family's features for configuration and nonvolatile data storage. The Spartan-3AN FPGAs are a member of the Extended Spartan-3A family, which also includes Spartan-3A FPGAs and Spartan-3A DSP FPGAs with a higher density. The XC3S700AN-4FGG484C performs exceptionally well for applications requiring small size, such as blade servers, medical devices, vehicle entertainment, telematics, GPS, and other small consumer items. When FPGA and Flash technology are integrated, system reliability is improved while chip count, PCB traces, and overall size are decreased.

The XC3S700AN-4FGG484C's internal configuration interface is totally self-contained, boosting design security. The family is still fully supportive of external configuration. As the first nonvolatile FPGA in the world to offer MultiBoot, which supports two or more configuration files on a single device and allows for alternative configurations for field upgrades, test modes, or other system configurations.

Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC3S700AN-4FGG484C Specifications

Specification Value
Number of LABs/CLBs 1472
Number of Logic Elements/Cells 13248
Total RAM Bits 368640
Number of I/O 372
Number of Gates 700000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0℃ ~ 85℃ (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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