XC7A200T-3FB676E

XC7A200T-3FB676E Overview

This part is part of the 676-BBGA, FCBGA package. To improve data transfer, there are 400 I/Os. 215360 logic cells make up a fundamental building unit. A Surface Mount-pin is used to connect an FPGA module to a development board. The device requires a supply voltage between 0.95 and 1.05 volts to function. This FPGA type is one of many in the Artix-7 family. When the unit is in use, operating temperatures should always be kept between 0°C and 100°C. In order to save space, Tray includes an FPGA model. This device gives you a total of 13455360 RAM bits. The basic part number, XC7A200T, can be used to distinguish related components. In order to guarantee that the software will function properly, it is crucial that this FPGA module has a RAM si1.6MBe of 1.6MB. This FPGA contains 16825 LABs/CLBs altogether. This FPGA should function flawlessly if put in Surface Mount, according to its specs. When used with a 1V supply voltage, its versatility can be completely utilized. The maximum operational temperature of this module, as a result of its design, is 100°C. Fpga electronics are required to keep the operating temperature above 0°C. Its fundamental building unit consists of 16825 logic blocks (LABs). There are 269200 registers utilized for data transmission and archiving. The 676-FCBGA (27x27) supplier package is what it goes by. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.

XC7A200T-3FB676E Features

• The Artix®-7 has higher system performance, programmable system integration, and reduced BOM costs.

• Reduction in total power (65% less static power and 50% less power than 45nm generation devices)

• Design productivity that is increased more quickly, scalable, optimized architecture, extensive tools, and IP

• Modern 28nm, high-k metal gate (HKMG), high performance, low power (HPL) technology

• Phase-locked loop and mixed mode clock managers are combined in effective clock management tiles (CMT).

• Options for lidless flip-chip packages, low cost wire bonding, and AXI IP (analogue mixed signal integration)

• I/O voltage range of 1.2V to 3.3V, high-speed serial connectivity, and integrated multi-gigabit transceivers

XC7A200T-3FB676E Applications

• Automated manufacturing

• Portable ultrasound

• Industrial control

• Sensor fusion

• Vehicles and transportation

• Embedded vision

• Consumer electronics

• Medical devices

• Defense applications

XC7A200T-3FB676E Specifications