XC7A75T-1FGG676C

XC7A75T-1FGG676C Overview

The high-performance FPGA XC7A75T-1FGG676C from Xilinx Inc. is intended for use in electrical systems. It has 5900 LABs/CLBs overall, 75520 logic cells overall, and 3870720 RAM bits overall. The 676-FBGA (27x27) supply device package and SMD mounting technique of this FPGA make it ideal for a variety of applications. This component's operating temperature range is 0°C to 85°C, and its supply voltage ranges from 0.95V to 1.05V. The 676-BGA package for the XC7A75T-1FGG676C FPGA has a manufacturer pack quantity of 40 units. Its popularity is minimal, and 34% of open market buyers perceive a phony danger from it. This component's supply and demand conditions are constrained, and its MSL level is 4 (72 hours). View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.

XC7A75T-1FGG676C Features

• Total Power Decrease

• Cost reduction for BOM

• Rapidly Increasing Design Productivity

• 16-bit bus, 512 MB micron DDR3, 800 or 667 MT/s, adjustable voltage

• High-speed host to FPGA data transfer via an efficient DPTI/DSPI interface.

• 25.6Gb/s peak DDR3-800 memory bandwidth

• Multiple USB cable connections are no longer necessary thanks to the onboard USB hub.

XC7A75T-1FGG676C Applications

• The embedded OEM

• Industrial control

• Consumer electronics

• Medical devices

• Defense and military

• Machine vision camera

• Portable ultrasound

• Sensor fusion

• Embedded vision

• Automated manufacturing

• Vehicles and transportation

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XC7A75T-1FGG676C Specifications