XC7A75T-L2FGG676E

XC7A75T-L2FGG676E Overview

XC7A75T-L2FGG676E was produced by AMD Xilinx. It has a tray-style packaging and is classified as an embedded-FPGA. It can be mounted on a surface and comes in a standard package size of 40. The total number of LABs/CLBs is 5900, whereas the number of I/O is 300. The total number of RAM bits is 3870720, and there are 75520 logic components or cells. The supplier device package is the 676-FBGA (27x27), and the voltage supply ranges from 0.95V to 1.05V. The operational temperature range for this 676-BGA component is 0°C to 100°C (TJ). Its open market fake danger is at 73%, and its MSL level is 4 (72 hours). The HTSUS is 8542.39.0001, and the REACH status is REACH Unaffected. The base product has the RoHS3 compliance designation XC7A75. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.

XC7A75T-L2FGG676E Features

• UART-USB bridge

• Circuitry for USB-JTAG programming

• PCB has mounting holes that are typical for the PC/104 form factor.

• Powered by a USB header or a 5 V external DC adapter connected to a barrel jack.

• Automatic USB and external power switching; external reception is preferred

• The NCP380 load switch lowers inrush current and limits USB current to 2 amps.

• Reduction in total power (65% less static power and 50% less power than 45nm generation devices)

XC7A75T-L2FGG676E Applications

• LTE radio and baseband

• Multifunction printers

• Medical diagnostics and imaging

• IP and Smart camera

• Video and night vision equipment

• Flat Panel Displays

• Industrial motor control, industrial networking, and machine vision

XC7A75T-L2FGG676E Specifications