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Home > Product > Xilinx, Inc > Artix-7 FPGA
XC7A75T-L2FTG256E

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XC7A75T-L2FTG256E

Manufacturer:
Xilinx
Package/Case:
FTBGA-256
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7A75T-L2FTG256E
Product Categories:
Artix-7 FPGA
Description:
FPGA Artix-7 Family 75520 Cells 28nm Technology 1V 256-Pin FTBGA Tray 170 I/O
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XC7A75T-L2FTG256E Overview

XC7A75T-L2FTG256E is included in the FBGA package. This kind of FPGA's component is called FIELD PROGRAMMABLE GATE ARRAY. To transport data more effectively, 170 I/Os are available. The fundamental component of a computer is logic components or cells. A power supply of 0.9V volts is necessary for the operation of fpga chips. These Field Programmable Gate Arrays components are a subset of FPGAs. 170 integrated outputs are present in the gadget. On fpga chips, there are a total of 256 terminations. The RAM si472.5kBe of this FPGA module needs to be at least 472.5kB GB in order for the application to run normally. The device has 256 pins built into it. This FPGA will function flawlessly in accordance with its specifications as long as it is put in Surface Mount. The versatility of 900mV supply voltage can be fully utilized by designers. A 0.9V battery, which can be bought separately, powers it. This module can withstand temperatures up to 100°C during normal operation. Operating temperatures must to be higher than 0°C. This item is an fpga semiconductor with 256 pins. 5900 logic blocks (LABs) make up the system's fundamental building block. The signal is typically produced by a crystal oscillating at 1098MHz. There are 94400 registers available for data storage and transfer as a result. This system has a special trait known as ALSO OPERATES AT 1V SUPPLY, which is a feature. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.


XC7A75T-L2FTG256E Features

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 

  • Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.

  • With 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power, it is designed for maximum performance and lowest power.


XC7A75T-L2FTG256E Applications

  • Driver information

  • Infotainment

  • Broadcast camera

  • Medical diagnostics and imaging

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • Video and night vision equipment

  • LTE radio and baseband


XC7A75T-L2FTG256E Specifications

SpecificationValue
MountSurface Mount
Package / CaseFBGA
Number of Pins256
Number of Terminations256
Max Operating Temperature100°C
Min Operating Temperature0°C
Terminal PositionBOTTOM
Terminal FormBALL
Supply Voltage0.9V
Terminal Pitch1mm
Pin Count256
Number of Outputs170
Qualification StatusNot Qualified
Operating Supply Voltage900mV
Supply Voltage-Max (Vsup)0.93V
Power Supplies0.9V
Number of I/O170
RAM Size472.5kB
Clock Frequency1098MHz
Propagation Delay850 ps
Number of Logic Elements/Cells75520
Number of Logic Blocks (LABs)5900
Number of Registers94400
Combinatorial Delay of a CLB-Max1.51 ns
Height Seated (Max)1.55mm


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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