XC7K160T-2FFG676I is an AMD Kintex™ 7 FPGA based on a 28 nm programmable logic architecture, designed to provide a balanced combination of logic capacity, DSP performance, high-speed serial connectivity, and I/O resources.
The device integrates 162,240 logic cells, 25,350 CLB slices, 600 DSP48E1 slices, 11,700 Kb of Block RAM, and eight GTX transceivers. The FFG676 package supports up to 400 user I/Os, making the device suitable for applications requiring substantial programmable logic together with high-bandwidth interfaces.
The -2 speed grade provides higher performance than the -1 grade, while the I temperature suffix identifies the device as an industrial-temperature version with a specified junction-temperature operating range of -40°C to +100°C.
With integrated DSP resources, Block RAM, GTX serial transceivers, PCI Express support, and flexible programmable I/O, XC7K160T-2FFG676I is well suited to communications, video processing, medical imaging, industrial instrumentation, and other data-intensive FPGA applications. AMD identifies Kintex 7 devices for applications including wireless communications, video-over-IP, display systems, and other performance-sensitive embedded designs.
XC7K160T-2FFG676I Features
XC7K160T-2FFG676I Applications
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| Specification | Recommended Value |
|---|---|
| Manufacturer | AMD |
| Product Family | Kintex™ 7 FPGA |
| Part Number | XC7K160T-2FFG676I |
| Device Type | Field Programmable Gate Array (FPGA) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| Logic Cells | 162,240 |
| CLB Slices | 25,350 |
| DSP Slices | 600 DSP48E1 |
| Block RAM | 11,700 Kb |
| Distributed RAM | Up to 2,188 Kb |
| GTX Transceivers | 8 |
| User I/O | Up to 400 |
| Package | FFG676, 676-ball FCBGA |
| Core Supply (VCCINT) | 0.97 V to 1.03 V |
| Mounting Type | Surface Mount |
| Operating Junction Temperature | -40°C to +100°C |
| Packaging Method | Tray |
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