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Home > Product > Xilinx, Inc > Kintex-7 FPGAs
XC7K160T-2FFG676I

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XC7K160T-2FFG676I

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
Product Categories:
FPGAs (Field Programmable Gate Array)
Description:
FPGA Kintex-7 Family IC 162240 Cells 28nm Technology 1V 676-Pin FCBGA Tray
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XC7K160T-2FFG676I is an AMD Kintex™ 7 FPGA based on a 28 nm programmable logic architecture, designed to provide a balanced combination of logic capacity, DSP performance, high-speed serial connectivity, and I/O resources.

The device integrates 162,240 logic cells, 25,350 CLB slices, 600 DSP48E1 slices, 11,700 Kb of Block RAM, and eight GTX transceivers. The FFG676 package supports up to 400 user I/Os, making the device suitable for applications requiring substantial programmable logic together with high-bandwidth interfaces.

The -2 speed grade provides higher performance than the -1 grade, while the I temperature suffix identifies the device as an industrial-temperature version with a specified junction-temperature operating range of -40°C to +100°C.

With integrated DSP resources, Block RAM, GTX serial transceivers, PCI Express support, and flexible programmable I/O, XC7K160T-2FFG676I is well suited to communications, video processing, medical imaging, industrial instrumentation, and other data-intensive FPGA applications. AMD identifies Kintex 7 devices for applications including wireless communications, video-over-IP, display systems, and other performance-sensitive embedded designs.

XC7K160T-2FFG676I Features

  • 162,240 logic cells
  • 25,350 configurable logic block (CLB) slices
  • 600 DSP48E1 slices for high-performance signal-processing and arithmetic functions
  • 11,700 Kb of Block RAM
  • 2,188 Kb maximum distributed RAM
  • 8 GTX high-speed serial transceivers
  • Up to 400 user I/Os
  • Integrated PCI Express block
  • Integrated XADC block
  • -2 speed grade
  • 676-ball FFG676 flip-chip BGA package
  • Industrial temperature grade: -40°C to +100°C junction temperature
  • Based on AMD/Xilinx 28 nm Kintex 7 FPGA architecture

XC7K160T-2FFG676I Applications

  • Wireless communication infrastructure
  • High-speed wired communications
  • Video and image processing
  • Broadcast video equipment
  • Video-over-IP systems
  • Medical imaging equipment
  • Industrial instrumentation
  • Test and measurement systems
  • High-performance DSP processing
  • PCI Express and high-speed data acquisition designs


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7K160T-2FFG676I Specifications

SpecificationRecommended Value
ManufacturerAMD
Product FamilyKintex™ 7 FPGA
Part NumberXC7K160T-2FFG676I
Device TypeField Programmable Gate Array (FPGA)
Speed Grade-2
Temperature GradeIndustrial (I)
Logic Cells162,240
CLB Slices25,350
DSP Slices600 DSP48E1
Block RAM11,700 Kb
Distributed RAMUp to 2,188 Kb
GTX Transceivers8
User I/OUp to 400
PackageFFG676, 676-ball FCBGA
Core Supply (VCCINT)0.97 V to 1.03 V
Mounting TypeSurface Mount
Operating Junction Temperature-40°C to +100°C
Packaging MethodTray


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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