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Home > Product > Xilinx, Inc > Kintex-7 FPGAs
XC7K325T-2FBG676C

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XC7K325T-2FBG676C

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7K325T-2FBG676C
Product Categories:
FPGAs (Field Programmable Gate Array)
Description:
FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 676-Pin Lidless FCBGA Tray 16404480 400 I/O
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XC7K325T-2FBG676C Overview

The AMD Xilinx XC7K325T-2FBG676C is classified as a Field Programmable Gate Array (FPGA). XC7K325T-2FBG676C offers a fully programmable alternative to ASSPs and ASICs. It is built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. XC7K325T-2FBG676C enables an unprecedented increase in system performance with 400 I/O, 16404480 Total RAM Bits. This device supplys 0.97V ~ 1.03V. The Xilinx FPGAs (Field Programmable Gate Array) series XC7K325T-2FBG676C is an FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.


XC7K325T-2FBG676C Features

  • Integration of AMS, VCXO component, AXI IP, and up to 478K logic cells

  • 32 × 12.5G GTs, 2,845 GMACs, 34MB BRAM, and DDR3-1866 are possible.

  • Half as expensive as comparable density 40nm gadgets

  • 40nm devices from earlier generations use 50% less power.

  • Extensive tools, a scalable, efficient architecture, and IP, boards, and kits

  • Cost savings, a 2x increase in price-performance, and lower costs

  • Advancements in Memory Controller

  • Maximize Connectivity While Maintaining Your Budget

  • Use of only half the power

  • The density of the xilinx Kintex-7 FPGA can reach 2 million logic units. Compared to the current and prior FPGAs, this is around 2.5 times greater.


XC7K325T-2FBG676C Applications

  • Medical Endoscope

  • Small Cell Baseband

  • Machine vision camera

  • Automated manufacturing

  • Portable ultrasound

  • Industrial control

  • Sensor fusion

  • Vehicles and transportation

  • Embedded vision


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7K325T-2FBG676C Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array)
MfrAMD
SeriesKintex®-7
PackageTray
Product StatusActive
Number of LABs/CLBs25475
Number of Logic Elements/Cells326080
Total RAM Bits16404480
Number of I/O400
Voltage - Supply0.97V ~ 1.03V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Base Product NumberXC7K325


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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