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Home > Product > Xilinx, Inc > Kintex-7 FPGAs
XC7K325T-2FFG676I

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XC7K325T-2FFG676I

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
Product Categories:
FPGAs (Field Programmable Gate Array)
Description:
FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 676-Pin FCBGA Tray
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XC7K325T-2FFG676I Overview

XC7K325T-2FFG676I is an AMD Kintex™ 7 FPGA designed for applications requiring a combination of programmable logic capacity, high-performance DSP resources, embedded memory, flexible I/O, and high-speed serial connectivity.

The device integrates 326,080 logic cells, 50,950 CLB slices, 840 DSP48E1 slices, and 16,020 Kb of Block RAM. In the FFG676 package, it provides 400 user I/Os and 8 GTX high-speed serial transceivers, making it suitable for data-intensive embedded, communications, video-processing, and instrumentation designs.

The -2 speed grade is specified for higher-performance operation than the -1 grade, while the I temperature suffix indicates an industrial junction-temperature range of -40°C to +100°C.

XC7K325T devices also integrate an XADC analog monitoring block, PCI Express interface capability, configurable Block RAM, DSP processing resources, and flexible SelectIO interfaces. These features support applications such as wireless communications, high-speed data acquisition, video processing, medical imaging, test equipment, and industrial systems.

XC7K325T-2FFG676I Features

  • 326,080 logic cells
  • 50,950 configurable logic block (CLB) slices
  • 840 DSP48E1 slices
  • 16,020 Kb of Block RAM
  • Up to 4,000 Kb of distributed RAM
  • 8 GTX transceivers in the FFG676 package
  • 400 user I/Os in the FFG676 package
  • 250 High-Range (HR) I/Os and 150 High-Performance (HP) I/Os
  • Integrated PCI Express block
  • Integrated XADC block with dual 12-bit ADCs
  • Support for high-speed DDR memory interfaces
  • -2 speed grade
  • FFG676, 676-ball flip-chip BGA package
  • Industrial temperature grade: -40°C to +100°C junction temperature
  • Based on AMD/Xilinx 28 nm Kintex 7 FPGA architecture

XC7K325T-2FFG676I Applications

  • Wireless communication infrastructure
  • High-speed wired communications
  • Video and image processing
  • Broadcast video equipment
  • Medical imaging systems
  • Industrial automation and control
  • Test and measurement equipment
  • High-speed data acquisition
  • PCI Express-based FPGA systems
  • DSP-intensive signal-processing applications


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7K325T-2FFG676I Specifications

SpecificationRecommended Value
ManufacturerAMD
Product FamilyKintex™ 7 FPGA
Part NumberXC7K325T-2FFG676I
Device TypeField Programmable Gate Array (FPGA)
Logic Cells326,080
CLB Slices50,950
DSP Slices840 DSP48E1
Block RAM16,020 Kb
Distributed RAMUp to 4,000 Kb
GTX Transceivers8
User I/O400
HR I/O250
HP I/O150
PCIe Blocks1
XADC Blocks1
Speed Grade-2
Temperature GradeIndustrial (I)
PackageFFG676, 676-ball FCBGA
Operating Junction Temperature-40°C to +100°C
Mounting TypeSurface Mount


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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