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Home > Product > Xilinx, Inc > Kintex-7 FPGAs
XC7K325T-3FF900C

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XC7K325T-3FF900C

Manufacturer:
Xilinx
Package/Case:
BGA
RoHS:
Lifecycle:
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7K325T-3FF900C
Product Categories:
Kintex-7 FPGAs
Description:
Kintex-7 FPGA 16020 Memory 326080 Cells 500 I/O
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XC7K325T-3FF900C Overview

A Field Programmable Gate Array XC7K325T-3FF900C is an integrated circuit that falls under the AMD Xilinx brand. XC7K325T-3FF900C offers a fully programmable alternative to ASSPs and ASICs. It is built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. XC7K325T-3FF900C enables an unprecedented increase in system performance with 500 I/O, 16020 Memory. This device supplys 0.97V ~ 1.03V. The Xilinx FPGAs (Field Programmable Gate Array) series XC7K325T-3FF900C is an FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.


XC7K325T-3FF900C Features

  • DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

  • Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 

  • Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.

  • With 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power, it is designed for maximum performance and lowest power.


XC7K325T-3FF900C Applications

  • Sensor fusion

  • Vehicles and transportation

  • Embedded vision

  • Consumer electronics

  • Medical devices

  • Defense applications

  • The embedded OEM

  • Software defined radio

  • Any-to-any connectivity


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7K325T-3FF900C Specifications

SpecificationValue
Logic Cells326,080
DSP Slices840
Memory16,020
GTX Transceivers16
I/O Pins500

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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