XC7K325T-L2FBG900E

XC7K325T-L2FBG900E Overview

Xilinx XC7K325T-L2FBG900E from AMD is an integrated circuit which fits into the Field Programmable Gate Array (FPGA) category. XC7K325T-L2FBG900E offers a fully programmable alternative to ASSPs and ASICs. It is built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. XC7K325T-L2FBG900E enables an unprecedented increase in system performance with 500 I/O, 16404480 Total RAM Bits. This device supplys 0.97V ~ 1.03V. The Xilinx FPGAs (Field Programmable Gate Array) series XC7K325T-L2FBG900E is an FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.

XC7K325T-L2FBG900E Features

• High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s. 

• A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip. 

• DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

• Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

• Utilize the MicroBlazeTM processor to quickly install embedded processing. 

• PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

• Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 

• Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.

• With 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power, it is designed for maximum performance and lowest power.

XC7K325T-L2FBG900E Applications

• Sensor fusion

• Embedded vision

• Software defined radio

• Programmable logic controller

• Machine vision camera

• Portable ultrasound

• ADAS

• Medical Endoscope

XC7K325T-L2FBG900E Specifications