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Home > Product > Xilinx, Inc > Kintex-7 FPGAs
XC7K325T-L2FFG676I

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XC7K325T-L2FFG676I

Manufacturer:
Xilinx
Package/Case:
676-BBGA, FCBGA
RoHS:
Lifecycle:
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7K325T-L2FFG676I
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
Kintex-7 FPGA 400 I/O 676FCBGA 16404480 326080 Cells
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XC7K325T-L2FFG676I Overview

A Field Programmable Gate Array XC7K325T-L2FFG676I is an integrated circuit that falls under the AMD Xilinx brand. XC7K325T-L2FFG676I offers a fully programmable alternative to ASSPs and ASICs. It is built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. XC7K325T-L2FFG676I enables an unprecedented increase in system performance with 400 I/O, 16404480 Total RAM Bits. This device supplys 0.97V ~ 1.03V. The Xilinx FPGAs (Field Programmable Gate Array) series XC7K325T-L2FFG676I is an FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.


XC7K325T-L2FFG676I Features

  • Real 6-input lookup table (LUT)-based advanced high-performance FPGA logic that may be configured as distributed memory. 

  • Block RAM with a built-in FIFO for on-chip data buffering, 36 Kb, twin ports. 

  • High-speed SelectIOTM technology that is compatible with DDR3 connections of up to 1,866 Mb/s. 

  • High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s. 

  • A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip. 

  • DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

  • Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 


XC7K325T-L2FFG676I Applications

  • Portable ultrasound

  • Industrial control

  • Sensor fusion

  • Vehicles and transportation

  • Embedded vision

  • Consumer electronics

  • Medical devices

  • Defense applications


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7K325T-L2FFG676I Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array)
MfrAMD
SeriesKintex®-7
PackageTray
Product StatusActive
Number of LABs/CLBs25475
Number of Logic Elements/Cells326080
Total RAM Bits16404480
Number of I/O400
Voltage - Supply0.97V ~ 1.03V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Base Product NumberXC7K325


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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