The AMD Xilinx XC7K410T-2FF900I is an integrated circuit that falls under the category of Field Programmable Gate Arrays (FPGAs). XC7K410T-2FF900I offers a fully programmable alternative to ASSPs and ASICs. It is built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. XC7K410T-2FF900I enables an unprecedented increase in system performance with 500 I/O, 29306880 Total RAM Bits. This device supplys 0.97V ~ 1.03V. The Xilinx FPGAs (Field Programmable Gate Array) series XC7K410T-2FF900I is an FPGA Kintex-7 Family 406720 Cells 28nm Technology 1V. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.
Real 6-input lookup table (LUT)-based advanced high-performance FPGA logic that may be configured as distributed memory.
Block RAM with a built-in FIFO for on-chip data buffering, 36 Kb, twin ports.
High-speed SelectIOTM technology that is compatible with DDR3 connections of up to 1,866 Mb/s.
High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s.
A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip.
DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.
Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter.
Utilize the MicroBlazeTM processor to quickly install embedded processing.
PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs.
Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types.
Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.
Automated manufacturing
Portable ultrasound
Industrial control
Sensor fusion
Vehicles and transportation
Embedded vision
Consumer electronics
Medical devices
Specification | Value |
Category | Integrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array) |
Mfr | AMD |
Series | Kintex®-7 |
Package | Tray |
Product Status | Active |
Number of LABs/CLBs | 31775 |
Number of Logic Elements/Cells | 406720 |
Total RAM Bits | 29306880 |
Number of I/O | 500 |
Voltage - Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31x31) |
Base Product Number | XC7K410 |
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