The XC7K410T-2FFG900I offers high performance and low power consumption for applications with a high rate of growth and wireless communications. The XC7K410T-2FFG900I now offers the exceptional performance and connectivity at price points that were previously only accessible to the highest volume applications.
The XC7K410T-2FFG900I allows designers to incorporate 12-bit digitally programmable analog with superior bandwidth while still adhering to budget and power restrictions. Thanks to the unique 144GMACS digital signal processor (DSP) power, the adaptable Kintex-7 devices are a fantastic choice for applications like portable ultrasound equipment and next-generation communications. The CPRI/OBSAI IP cores in the XC7K410T-2FFG900I are 9.8Gbps fast and deliver a maximum serial bandwidth (full duplex) of 800Gbps. The programmability of the reconfigurable XC7K410T-2FFG900I devices makes it simple to support a variety of air interfaces, including LTE, WiMAX, and WCDMA.
Up to 478K logic cells, VCXO component, AXI IP, and AMS integration
Up to 32 x 12.5G GTs, 2,845 GMACs, 34Mb BRAM, and DDR3-1866
Half the price of similar density 40nm devices
50% lower power than the previous generation 40nm devices
Scalable optimized architecture, comprehensive tools, IP, Boards, and Kits
The Flip Chip Ball Grid Array (FCBGA) packaging has many benefits in terms of performance and dependability. This packaging technology enables effective heat dissipation and improved electrical performance thanks to its compact design and high-density interconnects. The Surface Mount mounting method facilitates easy integration onto circuit boards and further streamlines the assembly process. By limiting the use of hazardous materials, this FCBGA package also complies fully with RoHS regulations, ensuring environmental friendliness. Additionally, being lead-free enhances its eco-friendliness while also satisfying the exacting standards of various industries. Overall, this FCBGA package offers a dependable and long-lasting solution for contemporary electronic applications by fusing cutting-edge features with compliance standards.
Avionics for Kintex-7 FPGA
LED Backlit Flat Panel Displays and 3DTV
LTE Baseband Solution
IP and Smart camera
Video and night vision equipment
LTE radio and baseband
Multifunction printers
Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.
AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.
| Specification | Value |
|---|---|
| Product Lifecycle Status | Active |
| Mounting Style | Surface Mount |
| Case/Package | FCBGA |
| RoHS | Compliant |
| Lead-Free Status | Lead Free |
| HK STC License | NLR |
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