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Home > Product > Xilinx, Inc > Kintex-7 FPGAs
XC7K410T-2FFG900I

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XC7K410T-2FFG900I

Manufacturer:
Xilinx
Package/Case:
FCBGA-900
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
Product Categories:
FPGAs
Description:
FPGA Kintex-7 Family 406720 Cells 28nm Technology 1V 900-Pin FCBGA Tray
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XC7K410T-2FFG900I Overview

The XC7K410T-2FFG900I offers high performance and low power consumption for applications with a high rate of growth and wireless communications. The XC7K410T-2FFG900I now offers the exceptional performance and connectivity at price points that were previously only accessible to the highest volume applications.
The XC7K410T-2FFG900I allows designers to incorporate 12-bit digitally programmable analog with superior bandwidth while still adhering to budget and power restrictions. Thanks to the unique 144GMACS digital signal processor (DSP) power, the adaptable Kintex-7 devices are a fantastic choice for applications like portable ultrasound equipment and next-generation communications. The CPRI/OBSAI IP cores in the XC7K410T-2FFG900I are 9.8Gbps fast and deliver a maximum serial bandwidth (full duplex) of 800Gbps. The programmability of the reconfigurable XC7K410T-2FFG900I devices makes it simple to support a variety of air interfaces, including LTE, WiMAX, and WCDMA.

 

XC7K410T-2FFG900I Features

  • Up to 478K logic cells, VCXO component, AXI IP, and AMS integration

  • Up to 32 x 12.5G GTs, 2,845 GMACs, 34Mb BRAM, and DDR3-1866

  • Half the price of similar density 40nm devices

  • 50% lower power than the previous generation 40nm devices

  • Scalable optimized architecture, comprehensive tools, IP, Boards, and Kits

The Flip Chip Ball Grid Array (FCBGA) packaging has many benefits in terms of performance and dependability. This packaging technology enables effective heat dissipation and improved electrical performance thanks to its compact design and high-density interconnects. The Surface Mount mounting method facilitates easy integration onto circuit boards and further streamlines the assembly process. By limiting the use of hazardous materials, this FCBGA package also complies fully with RoHS regulations, ensuring environmental friendliness. Additionally, being lead-free enhances its eco-friendliness while also satisfying the exacting standards of various industries. Overall, this FCBGA package offers a dependable and long-lasting solution for contemporary electronic applications by fusing cutting-edge features with compliance standards.

 

XC7K410T-2FFG900I Applications

  • Avionics for Kintex-7 FPGA

  • LED Backlit Flat Panel Displays and 3DTV

  • LTE Baseband Solution

  • IP and Smart camera

  • Video and night vision equipment

  • LTE radio and baseband

  • Multifunction printers


XC7K410T-2FFG900I Specifications

SpecificationValue
Product Lifecycle StatusActive
Mounting StyleSurface Mount
Case/PackageFCBGA
RoHSCompliant
Lead-Free StatusLead Free
HK STC LicenseNLR

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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