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Home > Product > Xilinx, Inc > Kintex-7 FPGAs
XC7K70T-L2FBG676E

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XC7K70T-L2FBG676E

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7K70T-L2FBG676E
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
FPGA Kintex-7 Family 65600 Cells 28nm Technology 1V 676-Pin Lidless FCBGA Tray 4976640 300 I/O
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XC7K70T-L2FBG676E Overview

The AMD Xilinx XC7K70T-L2FBG676E is classified as a Field Programmable Gate Array (FPGA). XC7K70T-L2FBG676E offers a fully programmable alternative to ASSPs and ASICs. It is built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. XC7K70T-L2FBG676E enables an unprecedented increase in system performance with 300 I/O, 4976640 Total RAM Bits. This device supplys 0.97V ~ 1.03V. The Xilinx FPGAs (Field Programmable Gate Array) series XC7K70T-L2FBG676E is an FPGA Kintex-7 Family 65600 Cells 28nm Technology 1V. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.


XC7K70T-L2FBG676E Features

  • Real 6-input lookup table (LUT)-based advanced high-performance FPGA logic that may be configured as distributed memory. 

  • Block RAM with a built-in FIFO for on-chip data buffering, 36 Kb, twin ports. 

  • High-speed SelectIOTM technology that is compatible with DDR3 connections of up to 1,866 Mb/s. 

  • High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s. 

  • A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip. 

  • DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.

  • Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

  • Utilize the MicroBlazeTM processor to quickly install embedded processing. 

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 


XC7K70T-L2FBG676E Applications

  • Embedded vision

  • Consumer electronics

  • Medical devices

  • Defense applications

  • The embedded OEM

  • Software defined radio

  • Any-to-any connectivity

  • Programmable logic controller


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7K70T-L2FBG676E Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array)
MfrAMD
SeriesKintex®-7
PackageTray
Product StatusActive
Number of LABs/CLBs5125
Number of Logic Elements/Cells65,600
Total RAM Bits4,976,640
Number of I/O300
Voltage - Supply0.97V ~ 1.03V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Base Product NumberXC7K70


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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