XC7S100-L1FGGA484I

XC7S100-L1FGGA484I Overview

This package is offered for sale and is a part of the 484-BGA bundle. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 338 I/Os make it possible to transfer data more logically. The fundamental units of logic consist of 102400 logic elements or cells. It is driven by an electrical supply voltage of 0.95V. Surface Mount connectors are used to connect FPGA modules to development boards. It requires a supply voltage of 0.92V–0.98V to function. One of the FPGAs in this category is the Spartan?-7 Series. When running, the temperature should be kept within the range of -40°C to 100°C TJ. This FPGA model is included in Tray as opposed to other FPGA models in order to conserve space. 484 terminations altogether. With regard to RAM bits, this device gives you a total of 4423680. This FPGA has 8000 LABs and CLBs built in. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.

XC7S100-L1FGGA484I Features

• Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter. 

• High-performance SelectIO™ technology: The high-performance SelectIO™ technology supports DDR3 interfaces up to 1,866 Mb/s.

• Integrated PCI Express® (PCIe) block: The integrated PCI Express® (PCIe) block supports up to x8 Gen3 Endpoint and Root Port designs.

• Powerful clock management tiles (CMT): The powerful clock management tiles (CMT) integrate mixed-mode clock manager (MMCM) and phase-locked loop (PLL) blocks for high precision and minimal jitter.

• Utilize the MicroBlazeTM processor to quickly install embedded processing. 

• PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs. 

• Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types. 

• Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.

• With 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power, it is designed for maximum performance and lowest power.

• MicroBlaze™ processor: The MicroBlaze™ processor is a soft processor that can be used to quickly deploy embedded processing.

• 36 Kb dual-port block RAM: The 36 Kb dual-port block RAM has integrated FIFO circuitry for on-chip data buffering.

XC7S100-L1FGGA484I Applications

• Medical Endoscope

• Small Cell Baseband

• Machine vision camera

• Portable ultrasound

• Industrial control

• Sensor fusion

• Embedded vision

• Consumer electronics

• Defense applications

XC7S100-L1FGGA484I Specifications