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Home > Product > Xilinx, Inc > FPGA Spartan-7
XC7S50-1FGGA484Q

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XC7S50-1FGGA484Q

Manufacturer:
Xilinx
Package/Case:
484-BBGA, FCBGA
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7S50-1FGGA484Q
Product Categories:
Embedded - FPGAs (Field Programmable Gate Array)
Description:
Spartan-7 FPGA 2764800 484-BGA XC7S50
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XC7S50-1FGGA484Q Overview

XC7S50-1FGGA484Q is supplied in the 484-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY gates. For more effective data transfer, there are 250 I/Os accessible. A computer's essential building block is its logic components or cells. It is driven by a 1V electrical supply voltage. With your development board connected via the Surface Mount connector, you can use this FPGA module. It can run at high speeds while being powered by a source voltage of 0.95V to 1.05V. The Spartan-7 series of FPGAs includes a particular kind of FPGA known as a Spartan-7 series FPGA. While the machine is running, it is advised that the operating temperature be kept within the range of -40°C to 125°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. On fpga chips, there are 484 terminations altogether. This type of device provides 2764800 RAM bits, which is a substantial amount of memory. The FPGA has an array of 4075 LABs/CLBs built in. View Substitutes & Alternatives, datasheets, stock, pricing from Vemeko, as well as other FPGAs goods, at www.vemeko.com.


XC7S50-1FGGA484Q Features

  • Utilize the MicroBlazeTM processor to quickly install embedded processing.

  • PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs.

  • Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types.

  • Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.

  • With 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power, it is designed for maximum performance and lowest power.


XC7S50-1FGGA484Q Applications

  • IP and Smart camera

  • Video and night vision equipment

  • LTE radio and baseband

  • Multifunction printers

  • Flat Panel Displays

  • Set-Top Boxes

  • Wireless Access

  • Industrial Ethernet and Motion Control


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7S50-1FGGA484Q Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array)
MfrAMD
SeriesSpartan®-7
PackageTray
Product StatusActive
DigiKey ProgrammableNot Verified
Number of LABs/CLBs4075
Number of Logic Elements/Cells52160
Total RAM Bits2764800
Number of I/O250
Voltage - Supply0.95V ~ 1.05V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 125°C (TJ)
Package / Case484-BGA
Supplier Device Package484-FPBGA (23x23)
Base Product NumberXC7S50


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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