XC7S6-2FTGB196I

XC7S6-2FTGB196I Overview

The XC7S6-2FTGB196I electronic component is manufactured by AMD Xilinx. It belongs to the FPGAs (Field Programmable Gate Array) group of embedded integrated circuits (ICs). It has a typical package size of 1, and it is packaged on a tray. 100 I/Os and a surface mount are present. 6000 logic elements/cells and 184320 RAM bits make up the entire XC7S6-2FTGB196I component. It is supplied in a 196-CSBGA (15x15) device package. It has an ECCN of EAR99 and complies with RoHS3. With an MSL level of 3 (168 hours), the false danger for this component is 65. A second part number for it is 122-2247, and its HTSUS is 8542.39.0001. This component's XC7S6 base product number. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.

XC7S6-2FTGB196I Features

• Dual 12-bit 1MSPS analog-to-digital converters with on-chip supply and heat sensors make up the user-configurable analog interface (XADC). 

• For high-performance filtering, including optimized symmetric coefficient filtering, DSP slices with a 25 x 18 multiplier, 48-bit accumulator, and pre-adder are used.

• High-speed serial connectivity with integrated multi-gigabit transceivers capable of speeds ranging from 600 Mb/s to 6.6 Gb/s and up to 28.05 Gb/s, as well as a specific low-power mode that is tailored for chip-to-chip interactions. 

• Numerous configuration options, such as built-in SEU detection and correction, 256-bit AES encryption with HMAC/SHA-256 authentication, and compatibility for commonplace memories.

• Flip-chip packaging with good signal integrity, wire-bonding, and low cost that allows for simple family migration inside the same package. Both Pb-free and Pb options are offered for all packages.

• 1.0V core voltage process technology, 28 nm, HKMG, HPL process, and 0.9V core voltage option for even lower power were used in the design to achieve great performance while using the fewest resources.

XC7S6-2FTGB196I Applications

• Machine Vision

• Driver information

• Broadcast camera

• Professional Cameras

• 100X Die-to-Die Connectivity

• Scalable Optimized Architecture

• 2X Price-Performance Improvement

XC7S6-2FTGB196I Specifications