XC7S75-L1FGGA676I

XC7S75-L1FGGA676I Overview

The AMD Xilinx 1323283-XC7S75-L1FGGA676I is an integrated circuit (IC) that belongs to the field programmable gate array (FPGA) category. It comes in a typical one-package tray packing. The IC has 400 I/O and a surface mount mounting style. The IC has 76800 logic cells and 6000 LABs/CLBs. There are 4331520 RAM bits in all. The IC's voltage supply ranges from 0.92V to 0.98V. The IC's device package is a 676-FPBGA (27x27) size. The IC can operate in temperatures between -40°C and 100°C (TJ). The IC has a false threat of 75 in the open market and complies with ECCN: 5A002A1. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.

XC7S75-L1FGGA676I Features

• High-speed serial connectivity with integrated multi-gigabit transceivers capable of speeds ranging from 600 Mb/s to 6.6 Gb/s and up to 28.05 Gb/s, as well as a specific low-power mode that is tailored for chip-to-chip interactions. 

• Dual 12-bit 1MSPS analog-to-digital converters with on-chip supply and heat sensors make up the user-configurable analog interface (XADC). 

• For high-performance filtering, including optimized symmetric coefficient filtering, DSP slices with a 25 x 18 multiplier, 48-bit accumulator, and pre-adder are used.

• Numerous configuration options, such as built-in SEU detection and correction, 256-bit AES encryption with HMAC/SHA-256 authentication, and compatibility for commonplace memories.

• Flip-chip packaging with good signal integrity, wire-bonding, and low cost that allows for simple family migration inside the same package. Both Pb-free and Pb options are offered for all packages.

• 1.0V core voltage process technology, 28 nm, HKMG, HPL process, and 0.9V core voltage option for even lower power were used in the design to achieve great performance while using the fewest resources.

XC7S75-L1FGGA676I Applications

• Driver information

• Broadcast camera

• Professional Cameras

• Machine Vision

• 2X Price-Performance Improvement

• 100X Die-to-Die Connectivity

• Scalable Optimized Architecture

XC7S75-L1FGGA676I Specifications