This AMD Xilinx XC7V2000T-L2FHG1761E belongs to the category of Field Programmable Gate Arrays (FPGAs). The XC7V2000T-L2FHG1761E FPGAs from Xilinx cover the full spectrum of system needs, from low cost, small form factor, cost-sensitive, high volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing ability for the high reliability needs beyond commercial applications. This device offers a fully programmable alternative to ASSPs and ASICs. They are built on a cutting-edge, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology. They enable an unprecedented increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP. Virtex-7, MMCM, PLL, 600 I/Os, 741 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1927 are all features of the Xilinx FPGAs (Field Programmable Gate Array) series XC7V2000T-L2FHG1761E. View Substitutes & Alternatives, datasheets, stock, pricing from Authorized Distributors, as well as other FPGAs goods, at www.vemeko.com.
High-speed serial communication with integrated multi-gigabit transceivers, providing a dedicated low-power mode that is suited for chip-to-chip interfaces, with maximum speeds ranging from 600 Mb/s to 6.6 Gb/s up to 28.05 Gb/s.
A user-configurable analog interface (XADC) with dual 12-bit 1MSPS analog-to-digital converters with supply and heat sensors built right into the chip.
DSP slices with an optimized symmetric coefficient filter and a 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering.
Phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks are combined in powerful clock management tiles (CMT) for high precision and low jitter.
Utilize the MicroBlazeTM processor to quickly install embedded processing.
PCI Express® (PCIe) integrated block supports up to x8 Gen3 Endpoint and Root Port designs.
Numerous configuration options, including HMAC/SHA-256 authentication, built-in SEU detection and correction, and support for common memory types.
Flip-chip packaging that is low-cost, wire-bonded, bare-die, and high signal integrity and allows for simple family migration in the same package. Both Pb-free versions of all packages and Pb versions of some packages are offered.
With 28 nm, HKMG, HPL process, 1.0V core voltage process technology, and 0.9V core voltage option for even lower power, it is designed for maximum performance and lowest power.
Sensor fusion
Vehicles and transportation
Embedded vision
Consumer electronics
Medical devices
Defense applications
The embedded OEM
Software defined radio
Specification | Value |
Category | Integrated Circuits (ICs) Embedded FPGAs (Field Programmable Gate Array) |
Mfr | AMD |
Series | Virtex®-7 T |
Package | Tray |
Product Status | Active |
Number of LABs/CLBs | 152700 |
Number of Logic Elements/Cells | 1954560 |
Total RAM Bits | 47628288 |
Number of I/O | 850 |
Voltage - Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 100°C (TJ) |
Package / Case | 1760-BBGA, FCBGA |
Supplier Device Package | 1761-FCBGA (45x45) |
Base Product Number | XC7V2000 |
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