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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-1FBG676I

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XC7Z030-1FBG676I

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7Z030-1FBG676I
Product Categories:
System On Chip (SoC)
Description:
Zynq-7000 SoC Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 125K Logic Cells 256KB 676-FCBGA
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XC7Z030-1FBG676I Overview

This Xilinx AMD XC7Z030-1FBG676I embedded IC belongs to the Zynq-7000 SoC of field-programmable gate arrays. A Dual ARM Cortex-A9 MPCore with CoreSight processor running at 667MHz is included. CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG are among the communication options available for the device. XC7Z030-1FBG676I can withstand temperatures between -40°C and 100°C and contains 256 KB of RAM. The component is packaged in a 676-FCBGA (27x27) case. The addition of an application processor makes it possible to support advanced operating systems, such Linux. There are several common operating systems for the Cortex-A9 processor available for the Zynq-7000 family as well. The user of these devices can shut down the PL for power management if necessary because the PS and the PL are on distinct power domains. Because the PS processors always start up first, PL configuration may be done from a software perspective. As software running on the CPU controls PL setup, it boots similarly to an ASSP.

 

XC7Z030-1FBG676I Features

  • On-chip voltage and temperature sensing

  • Up to 17 external differential input channels

  • One million samples per second maximum conversion rate

  • Supports LVCMOS, LVDS, and SSTL

  • 1.2V to 3.3V I/O

  • Programmable I/O delay and SerDes

  • Supports Root complex and End Point configurations

  • Supports up to Gen2 speeds

  • Supports up to 8 lanes

  • Up to 16 receivers and transmitters

  • Supports up to 12.5 Gb/s data rates

 

XC7Z030-1FBG676I Applications

  • Video and night vision equipment

  • LTE radio and baseband

  • Multifunction printers

  • Flat Panel Displays

  • Set-Top Boxes

  • Wireless Access

  • Industrial Ethernet and Motion Control

  • Automotive


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7Z030-1FBG676I Specifications

SpecificationValue
CategoryEmbedded System On Chip (SoC)
MfrAMD
SeriesZynq-7000 SoC
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z030


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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