This Xilinx AMD XC7Z030-1FBG676I embedded IC belongs to the Zynq-7000 SoC of field-programmable gate arrays. A Dual ARM Cortex-A9 MPCore with CoreSight processor running at 667MHz is included. CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG are among the communication options available for the device. XC7Z030-1FBG676I can withstand temperatures between -40°C and 100°C and contains 256 KB of RAM. The component is packaged in a 676-FCBGA (27x27) case. The addition of an application processor makes it possible to support advanced operating systems, such Linux. There are several common operating systems for the Cortex-A9 processor available for the Zynq-7000 family as well. The user of these devices can shut down the PL for power management if necessary because the PS and the PL are on distinct power domains. Because the PS processors always start up first, PL configuration may be done from a software perspective. As software running on the CPU controls PL setup, it boots similarly to an ASSP.
On-chip voltage and temperature sensing
Up to 17 external differential input channels
One million samples per second maximum conversion rate
Supports LVCMOS, LVDS, and SSTL
1.2V to 3.3V I/O
Programmable I/O delay and SerDes
Supports Root complex and End Point configurations
Supports up to Gen2 speeds
Supports up to 8 lanes
Up to 16 receivers and transmitters
Supports up to 12.5 Gb/s data rates
Video and night vision equipment
LTE radio and baseband
Multifunction printers
Flat Panel Displays
Set-Top Boxes
Wireless Access
Industrial Ethernet and Motion Control
Automotive
Specification | Value |
Category | Embedded System On Chip (SoC) |
Mfr | AMD |
Series | Zynq-7000 SoC |
Package | Tray |
Product Status | Active |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
Operating Temperature | -40°C ~ 100°C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27x27) |
Number of I/O | 130 |
Base Product Number | XC7Z030 |
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