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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-1FF676I

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XC7Z030-1FF676I

Manufacturer:
Xilinx
Package/Case:
676-BBGA, FCBGA
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z030-1FF676I
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 125K Logic Cells 256KB 676-FCBGA
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XC7Z030-1FF676I Overview

This XC7Z030-1FF676I chip offers dependable performance to its consumers due to the implementation of 256KB RAM. This SoC design uses an MCU and FPGA combination for its internal architecture. Zynq-7000 series system on chips with included SoCs. The recommended working temperature range for this XC7Z030-1FF676I is -40°C to 100°C TJ. The Kintex-7 FPGA and 125K Logic Cells together make up an important aspect of this SoC's security. Modern Tray packaging was used in the design of this system-on-chip (SoC). This SoC part features a total of 4 I/Os. There are 676 terminations altogether, which is excellent for a system on a chip.GPIO WITH FOUR 32-BIT BANKS is another feature of this SoC processor. In this SoC, a 667MHz clock frequency is utilized.

 

XC7Z030-1FF676I Features

  • Two SD/SDIO 2.0/MMC3.31 compliant controllers

  • Two full-duplex SPI ports with three peripheral chip selects

  • Two high-speed UARTs (up to 1 Mb/s)

  • Two master and slave I2C interfaces

  • GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

  • Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

  • High-bandwidth connectivity within PS and between PS and PL

  • ARM AMBA® AXI based

  • QoS support on critical masters for latency and bandwidth control

 

XC7Z030-1FF676I Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


XC7Z030-1FF676I Specifications

SpecificationValue
TypeDescription
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z030


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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