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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-1FFG676C

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XC7Z030-1FFG676C

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z030-1FFG676C
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 125K Logic Cells 256KB 676-FCBGA
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XC7Z030-1FFG676C Overview

XC7Z030-1FFG676C is an integrated circuit that falls under the embedded system on chip (SoC) subcategory. It belongs to the Zynq-7000 series and is made by AMD Xilinx. This IC runs at 667MHz and has two ARM Cortex-A9 MPCores with CoreSight. XC7Z030-1FFG676C comes with a tray package and a typical package of 1. It can connect to devices using CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, among other protocols. There are 130 I/O ports and a DMA peripheral on it. It has a flash size of and a RAM size of 256KB. Its key characteristics are Kintex-7 FPGA and 125K logic cells, and it has a distinctive design of MCU and FPGA. XC7Z030-1FFG676C has a package/case of 676-BBGA, FCBGA and a supplier device package of 676-FCBGA (27x27). It has an operating temperature range of 0°C to 85°C (TJ) and is ECCN: 3A991D.

 

XC7Z030-1FFG676C Features

  • Multiprotocol dynamic memory controller

  • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

  • ECC support in 16-bit mode

  • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

  • Static memory interfaces

  • 8-bit SRAM data bus with up to 64 MB support

  • Parallel NOR flash support

  • ONFI1.0 NAND flash support (1-bit ECC)

  • 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit) serial NOR flash

 

XC7Z030-1FFG676C Applications

  • Automotive driver assistance

  • Driver information

  • Infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


XC7Z030-1FFG676C Specifications

SpecificationValue
TypeDescription
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z030


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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