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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-1SBG485C

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XC7Z030-1SBG485C

Manufacturer:
Xilinx
Package/Case:
FCBGA-485
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7Z030-1SBG485C
Product Categories:
Embedded - System On Chip (SoC)
Description:
Zynq®-7000 Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 667MHz 125K Logic Cells 484-FCBGA
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XC7Z030-1SBG485C Overview

The Zynq-7000 series of integrated circuits, including the XC7Z030-1SBG485C, is made for embedded system-on-chip (SoC) applications. Developers may optimize performance and power consumption thanks to the dual ARM Cortex-A9 MPCore processor's CoreSight technology. The CPU is 667MHz fast and comes in a tray with a single standard box. The device comes with DMA peripherals and is connected to CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The system contains 256 KB of RAM, 130 I/Os, and no flash memory. The device has an MCU and FPGA architecture, and it primarily resembles a Kintex-7 FPGA with 125K logic cells. The device is packaged in a 484-FBGA, FCBGA package with a supplier device package of 484-FCBGA (19x19). It operates in a temperature range of 0°C to 85°C (TJ) and has an ECCN of EAR99.

The Xilinx SoC architecture serves as the foundation for this XC7Z030-1SBG485C. These products combine a 28 nm Xilinx programmable logic (PL) chip and a feature-rich dual-core or single-core ARM® CortexTM-A9 processor system (PS) into a single unit. The ARM Cortex-A9 CPUs, which also have on-chip memory, external memory interfaces, and a wide range of peripheral connectivity interfaces, constitute the PS's brains.

 

XC7Z030-1SBG485C Features

  • Two SD/SDIO 2.0/MMC3.31 compliant controllers

  • Two full-duplex SPI ports with three peripheral chip selects

  • Two high-speed UARTs (up to 1 Mb/s)

  • Two master and slave I2C interfaces

  • GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

  • Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

  • High-bandwidth connectivity within PS and between PS and PL

  • ARM AMBA® AXI based

  • QoS support on critical masters for latency and bandwidth control

 

XC7Z030-1SBG485C Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7Z030-1SBG485C Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case484-FBGA, FCBGA
Supplier Device Package484-FCBGA (19x19)
Number of I/O130
Base Product NumberXC7Z030


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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