A somewhat unpopular electronic component made by Xilinx Inc. is the XC7Z030-2FBG484I. Dual ARM Cortex-A9 MPCore with CoreSight, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG connectivity, DMA peripherals, and 130 I/O are features of this MCU and FPGA device. The device has 256KB of RAM and a Kintex-7 FPGA with 125K logic cells as its architecture. The device has a temperature operating range of -40°C to 100°C and is packaged in a 484-FCBGA (23x23) supplier device.
Using the Zynq-7000 architecture, custom software and logic can be implemented in the PL and PS. Using the Zynq-7000 architecture, custom software and logic can be implemented in the PL and PS. It makes it possible to carry out unique and differentiating system functions. Two-chip systems (such an ASSP with an FPGA) cannot reach the performance levels available with the PS and PL integrated together due to their limited I/O bandwidth, latency, and power budgets. makes it possible to carry out unique and differentiating system functions. Two-chip systems (such an ASSP with an FPGA) cannot reach the performance levels available with the PS and PL integrated together due to their limited I/O bandwidth, latency, and power budgets.
XC7Z030-2FBG484I Features
Intel EHCI compliant USB host
8-bit ULPI external PHY interface
Two full CAN 2.0B compliant CAN bus interfaces
CAN 2.0-A and CAN 2.0-B and ISO 118981-1 standard compliant
External PHY interface
Two full-duplex SPI ports with three peripheral chip selects
Two high-speed UARTs (up to 1 Mb/s)
Two SD/SDIO 2.0/MMC3.31 compliant controllers
Two master and slave I2C interfaces
XC7Z030-2FBG484I Applications
ADAS
Medical Endoscope
Small Cell Baseband
Professional Cameras
Machine Vision
Carrier Ethernet Backhaul
Multi-function Printers
Multi-Axis Motor Control
Machine Vision
Programmable Logic Controller
Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.
AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.
| Specification | Value |
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Mfr | AMD |
| Series | Zynq®-7000 |
| Package | Tray |
| Product Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 484-BBGA, FCBGA |
| Supplier Device Package | 484-FCBGA (23x23) |
| Number of I/O | 130 |
| Base Product Number | XC7Z030 |
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