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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-2FF676I

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XC7Z030-2FF676I

Manufacturer:
Xilinx
Package/Case:
676-BBGA, FCBGA
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z030-2FF676I
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 125K Logic Cells 256KB 676-FCBGA
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XC7Z030-2FF676I Overview

The XC7Z030-2FF676I’s architecture enables implementation of custom logic in the PL and custom software in the PS. It allows for the realization of unique and differentiated system functions. The integration of the PS with the PL allows levels of performance that two-chip solutions (e.g., an ASSP with an FPGA) cannot match due to their limited I/O bandwidth, latency, and power budgets.

XC7Z030-2FF676I offers a large number of soft IP for the Zynq-7000 family. Stand-alone and Linux device drivers are available for the peripherals in the PS and the PL. The Vivado® Design Suite development environment enables a rapid product development for software, hardware, and systems engineers.

 

XC7Z030-2FF676I Features

  • Multiprotocol dynamic memory controller

  • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

  • ECC support in 16-bit mode

  • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

  • Static memory interfaces

  • 8-bit SRAM data bus with up to 64 MB support

  • Parallel NOR flash support

  • ONFI1.0 NAND flash support (1-bit ECC)

  • 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit) serial NOR flash

 

XC7Z030-2FF676I Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


XC7Z030-2FF676I Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z030


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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