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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-2FFG676I

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XC7Z030-2FFG676I

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
Product Categories:
Microprocessors
Description:
FPGA Kintex-7 Family IC 125000 Cells 28nm Technology 1V Automotive 676-Pin FCBGA
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XC7Z030-2FFG676I Overview

The device combines an ARM®-based processor's software programmability with an FPGA's hardware programmability, providing essential analytics and hardware acceleration while integrating CPU, DSP, ASSP, and mixed signal functions on a single device. The XC7Z030-2FFG676I SoC platform, comprised of single-core Zynq 7000S and dual-core Zynq 7000 devices, provides an exceptional price-to-performance-per-watt, completely scalable SoC platform for your specific application requirements.

XC7Z030-2FFG676I Features

  • External Memory Interfaces

  • I/O Peripherals and Interfaces

  • Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints

  • USB 2.0 compliant device IP core

  • Supports on-the-go, high-speed, full-speed, and low-speed modes

  • Intel EHCI compliant USB host

  • 8-bit ULPI external PHY interface

XC7Z030-2FFG676I Applications

  • Industial Automation

  • Communications

  • Automotive

  • Medical

  • Consumer Electronics


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7Z030-2FFG676I Specifications

SpecificationValue
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature-40℃ ~ 100℃ (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)

Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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