An AMD System on Chip (SoC) from the Zynq-7000 series is the XC7Z030-3FBG676E. With CoreSightTM for effective processing, it has two ARM Cortex-A9 MPCoreTM processors. It provides quick and responsive performance at 1GHz. This SoC is packaged on a tray and is intended for embedded applications. It is adaptable for a variety of applications thanks to its connectivity options, which include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. For interacting with external devices, it includes 130 I/O pins. This SoC offers versatility and power for a variety of applications thanks to its 256KB of RAM and design that blends MCU and FPGA. It comes in a surface-mountable 676-BBGA, FCBGA package.
The Xilinx SoC architecture serves as the foundation for the Zynq®-7000 family. These products combine a 28 nm Xilinx programmable logic (PL) chip and a feature-rich dual-core or single-core ARM® CortexTM-A9 processor system (PS) into a single unit. The ARM Cortex-A9 CPUs, which also have on-chip memory, external memory interfaces, and a wide range of peripheral connectivity interfaces, constitute the PS's brains.
Multiprotocol dynamic memory controller
16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories
ECC support in 16-bit mode
1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories
Static memory interfaces
8-bit SRAM data bus with up to 64 MB support
Parallel NOR flash support
ONFI1.0 NAND flash support (1-bit ECC)
1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit) serial NOR flash
Automotive driver assistance, driver information, and infotainment
Broadcast camera
Industrial motor control, industrial networking, and machine vision
IP and Smart camera
LTE radio and baseband
Medical diagnostics and imaging
Multifunction printers
Video and night vision equipment
Specification | Value |
Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Mfr | AMD |
Series | Zynq®-7000 |
Package | Tray |
Product Status | Active |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 1GHz |
Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
Operating Temperature | 0°C ~ 100°C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27x27) |
Number of I/O | 130 |
Base Product Number | XC7Z030 |
Buy XC7Z007S-2CLG225E Xilinx, Inc, Get familiar with the XC7Z007S-2CLG225E Zynq-7000 SoC at VEKEMO F...
Buy XC7Z007S-1CLG400I Xilinx, Inc, Get familiar with the XC7Z007S-1CLG400I Zynq-7000 SoC at VEKEMO F...
Buy XC7Z007S-1CLG400C Xilinx, Inc, Get familiar with the XC7Z007S-1CLG400C Zynq-7000 SoC at VEKEMO F...
Buy XC7Z007S-1CLG225I Xilinx, Inc, Get familiar with the XC7Z007S-1CLG225I Zynq-7000 SoC at VEKEMO F...
Buy XC7Z007S-1CLG225C Xilinx, Inc, Get familiar with the XC7Z007S-1CLG225C Zynq-7000 SoC at VEKEMO F...