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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-3FBG676E

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XC7Z030-3FBG676E

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z030-3FBG676E
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 125K Logic Cells 256KB 676-FCBGA
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XC7Z030-3FBG676E Overview

An AMD System on Chip (SoC) from the Zynq-7000 series is the XC7Z030-3FBG676E. With CoreSightTM for effective processing, it has two ARM Cortex-A9 MPCoreTM processors. It provides quick and responsive performance at 1GHz. This SoC is packaged on a tray and is intended for embedded applications. It is adaptable for a variety of applications thanks to its connectivity options, which include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. For interacting with external devices, it includes 130 I/O pins. This SoC offers versatility and power for a variety of applications thanks to its 256KB of RAM and design that blends MCU and FPGA. It comes in a surface-mountable 676-BBGA, FCBGA package.

The Xilinx SoC architecture serves as the foundation for the Zynq®-7000 family. These products combine a 28 nm Xilinx programmable logic (PL) chip and a feature-rich dual-core or single-core ARM® CortexTM-A9 processor system (PS) into a single unit. The ARM Cortex-A9 CPUs, which also have on-chip memory, external memory interfaces, and a wide range of peripheral connectivity interfaces, constitute the PS's brains.

 

XC7Z030-3FBG676E Features

  • Multiprotocol dynamic memory controller

  • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

  • ECC support in 16-bit mode

  • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

  • Static memory interfaces

  • 8-bit SRAM data bus with up to 64 MB support

  • Parallel NOR flash support

  • ONFI1.0 NAND flash support (1-bit ECC)

  • 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit) serial NOR flash

 

XC7Z030-3FBG676E Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


XC7Z030-3FBG676E Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1GHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z030


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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