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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-L2FBG676I

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XC7Z030-L2FBG676I

Manufacturer:
Xilinx
Package/Case:
676-BBGA, FCBGA
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z030-L2FBG676I
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 125K Logic Cells 256KB 676-FCBGA
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XC7Z030-L2FBG676I Overview

A high-performance system-on-chip (SoC) integrated circuit (IC) from the Zynq-7000 series is the XC7Z030-L2FBG676I. 800MHz twin ARM Cortex-A9 MPCoreTM processors with CoreSightTM are included in this device. Applications that require both microcontroller and field-programmable gate array (FPGA) capabilities are the target market for this potent SoC. Numerous connectivity choices are available with the XC7Z030-L2FBG676I, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, and UART/USART. For effective data transport, it also has DMA. This SoC offers plenty of versatility for interacting with external devices thanks to its 130 I/O pins. A Kintex-7 FPGA, which offers 125K logic cells for the implementation of complicated digital designs, serves as the foundation for the XC7Z030-L2FBG676I. It can operate reliably in situations with a temperature range of -40°C to 100°C.

The XC7Z030-L2FBG676I is an excellent and dependable option for embedded systems and is produced by AMD, a top supplier of integrated circuits. The XC7Z030-L2FBG676I offers the processing power and flexibility you require, whether you're developing a high-performance industrial control system or a sophisticated communication device.

 

XC7Z030-L2FBG676I Features

  • 32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)

  • 512 KB 8-way set-associative Level 2 cache (shared between the CPUs)

  • Byte-parity support

  • On-chip boot ROM

  • 256 KB on-chip RAM (OCM)

  • Byte-parity support

 

XC7Z030-L2FBG676I Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


XC7Z030-L2FBG676I Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z030


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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