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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z030-L2FFG676I

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XC7Z030-L2FFG676I

Manufacturer:
Xilinx
Package/Case:
676-BBGA, FCBGA
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z030-L2FFG676I
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 125K Logic Cells 256KB 676-FCBGA
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XC7Z030-L2FFG676I Overview

The high-performance AMD Xilinx XC7Z030-L2FFG676I electronic component is ideal for electronic devices that need a quick processing speed. It contains a twin 800MHz ARM Cortex-A9 MPCoreTM CPU with CoreSightTM cores. Additionally, this XC7Z030-L2FFG676I component has a Kintex-7 FPGA with 125K logic cells and a -40 to 100°C temperature range. For electronic gadgets that need a fast data processing system, it is a perfect option. XC7Z030-L2FFG676I is based on the Xilinx SoC architecture. These products integrate a feature-rich dual-core or single-core ARM®

Cortex™-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.

 

XC7Z030-L2FFG676I Features

  • Two SD/SDIO 2.0/MMC3.31 compliant controllers

  • Two full-duplex SPI ports with three peripheral chip selects

  • Two high-speed UARTs (up to 1 Mb/s)

  • Two master and slave I2C interfaces

  • GPIO with four 32-bit banks, of which up to 54 bits can be used with the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to two banks of 32b) connected to the Programmable Logic

  • Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments

 

XC7Z030-L2FFG676I Applications

  • Automotive driver assistance

  • Driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers


XC7Z030-L2FFG676I Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z030


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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