This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.
Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z035-1FBG676C

Images are for reference only.

XC7Z035-1FBG676C

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7Z035-1FBG676C
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 275K Logic Cells 256KB 676-FCBGA
Need this part? Submit an inquiry and our sourcing team will check current availability, source, date code, packaging and lead time.
quantity
email
contact
company
Telephone
country
content

XC7Z035-1FBG676C Overview

A System on Chip (SoC) from the Zynq-7000 series of integrated circuits is the XC7Z035-1FBG676C. It offers strong processing capabilities because to the integration of CoreSight technology and two ARM Cortex-A9 MPCore processors. XC7Z035-1FBG676C can easily handle demanding programs thanks to its speed of 667MHz. With 130 I/O pins, the XC7Z035-1FBG676C provides a variety of connectivity options, including CANbus, Ethernet, SPI, UART/USART, and USB OTG. Additionally, it has add-ons like DMA for effective data transport. This SoC has a Kintex-7 FPGA with 275K logic cells that allows for the construction of intricate digital designs. It is made by AMD and functions between 0 and 85 degrees Celsius. The XC7Z035-1FBG676C is an active product that is frequently utilized in applications that call for programmable logic and high-performance processing.

XC7Z035-1FBG676C is based on the Xilinx SoC architecture. These products integrate a feature-rich dual-core or single-core ARM® Cortex™-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.

 

XC7Z035-1FBG676C Features

  • Two 10/100/1000 tri-speed Ethernet MAC peripherals with IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support

  • Scatter-gather DMA capability

  • Recognition of 1588 rev. 2 PTP frames

  • GMII, RGMII, and SGMII interfaces

  • Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints

  • USB 2.0 compliant device IP core

  • Supports on-the-go, high-speed, full-speed, and low-speed modes

  • Intel EHCI compliant USB host

  • 8-bit ULPI external PHY interface

  • Two full CAN 2.0B compliant CAN bus interfaces

  • CAN 2.0-A and CAN 2.0-B and ISO 118981-1 standard compliant

  • External PHY interface

 

XC7Z035-1FBG676C Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7Z035-1FBG676C Specifications

SpecificationValue
TypeDescription
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 275K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z035


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

ASSOCIATED PRODUCTS

  • XC7Z007S-2CLG225E

    XC7Z007S-2CLG225E

    Buy XC7Z007S-2CLG225E Xilinx, Inc, Get familiar with the XC7Z007S-2CLG225E Zynq-7000 SoC at VEKEMO F...

  • XC7Z007S-1CLG400I

    XC7Z007S-1CLG400I

    Buy XC7Z007S-1CLG400I Xilinx, Inc, Get familiar with the XC7Z007S-1CLG400I Zynq-7000 SoC at VEKEMO F...

  • XC7Z007S-1CLG400C

    XC7Z007S-1CLG400C

    Buy XC7Z007S-1CLG400C Xilinx, Inc, Get familiar with the XC7Z007S-1CLG400C Zynq-7000 SoC at VEKEMO F...

  • XC7Z007S-1CLG225I

    XC7Z007S-1CLG225I

    Buy XC7Z007S-1CLG225I Xilinx, Inc, Get familiar with the XC7Z007S-1CLG225I Zynq-7000 SoC at VEKEMO F...

  • XC7Z007S-1CLG225C

    XC7Z007S-1CLG225C

    Buy XC7Z007S-1CLG225C Xilinx, Inc, Get familiar with the XC7Z007S-1CLG225C Zynq-7000 SoC at VEKEMO F...