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XC7Z035-1FFG676C

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XC7Z035-1FFG676C

Manufacturer:
Xilinx
Package/Case:
676-BBGA, FCBGA
RoHS:
Lifecycle:
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z035-1FFG676C
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 275K Logic Cells 256KB 676-FCBGA
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XC7Z035-1FFG676C Overview

A system on chip (SoC) from AMD Xilinx's Zynq-7000 series is the XC7Z035-1FFG676C. It has a dual ARM Cortex-A9 MPCore processor that runs at 667MHz and has CoreSight. This SoC features 275K logic cells overall and 256KB of RAM. It features 130 I/Os and is packaged in a 676-BBGA, FCBGA configuration. XC7Z035-1FFG676C offers CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG as connectivity options. The fake threat for this device, with the ECCN 3A991D, is 75% in the open market. It has a REACH unaffected status and is at MSL level 4 (72 hours). It does not comply with RoHS, and its HTSUS code is 8542.39.0001.

The XC7Z035-1FFG676C is based on the Xilinx SoC architecture. These products integrate a feature-rich dual-core or single-core ARM® Cortex™-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.

 

XC7Z035-1FFG676C Features

  • Multiprotocol dynamic memory controller

  • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

  • ECC support in 16-bit mode

  • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

  • Static memory interfaces

  • 8-bit SRAM data bus with up to 64 MB support

  • Parallel NOR flash support

  • ONFI1.0 NAND flash support (1-bit ECC)

  • 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit) serial NOR flash

 

XC7Z035-1FFG676C Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


XC7Z035-1FFG676C Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 275K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z035


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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