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The XC7Z035-2FFG676E architecture enables implementation of custom logic in the PL and custom software in the PS. It allows for the realization of unique and differentiated system functions. The integration of the PS with the PL allows levels of performance that two-chip solutions (e.g., an ASSP with an FPGA) cannot match due to their limited I/O bandwidth, latency, and power budgets.
On-chip voltage and temperature sensing
Up to 17 external differential input channels
One million samples per second maximum conversion rate
Supports LVCMOS, LVDS, and SSTL
1.2V to 3.3V I/O
Programmable I/O delay and SerDes
18 x 25 signed multiply
48-bit adder/accumulator
25-bit pre-adder
True Dual-Port
Up to 72 bits wide
Configurable as dual 18 Kb block RAM
Automotive driver assistance, driver information, and infotainment
Broadcast camera
Industrial motor control, industrial networking, and machine vision
IP and Smart camera
LTE radio and baseband
Medical diagnostics and imaging
Multifunction printers
Video and night vision equipment
Specification | Value |
Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Mfr | AMD |
Series | Zynq®-7000 |
Package | Tray |
Product Status | Active |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
Operating Temperature | 0°C ~ 100°C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27x27) |
Number of I/O | 130 |
Base Product Number | XC7Z035 |
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