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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z035-2FFG676I

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XC7Z035-2FFG676I

Manufacturer:
Xilinx
Package/Case:
FCBGA-676
RoHS:
Lifecycle:
Active
Availability:
On Request
This product page is provided for component identification and sourcing reference. Listing of a part number does not indicate current physical inventory. Availability, source, date code, packaging, condition and lead time are subject to confirmation at the time of quotation.
Datasheet:
XC7Z035-2FFG676I
Product Categories:
System On Chip (SoC)
Description:
FPGA Kintex-7 Family 275000 Cells 28nm Technology Automotive 676-Pin FCBGA
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XC7Z035-2FFG676I Overview

The XC7Z035-2FFG676I is a Zynq-7000 series electronic component with 256KB RAM manufactured by Xilinx Inc. It is a high-performance component featuring a Kintex-7 FPGA with 275K logic cells and a dual ARM Cortex-A9 MPCore with CoreSight processor. XC7Z035-2FFG676I is moderately well-liked and has a constrained supply and demand situation. The XC7Z035-2FFG676I is an 800MHz chip in a 676-BBGA, FCBGA package. It is appropriate for many applications, including MCU and FPGA. It has CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG connection. The Xilinx SoC architecture serves as the foundation for the Zynq®-7000 family. These products combine a 28 nm Xilinx programmable logic (PL) chip and a feature-rich dual-core or single-core ARM® CortexTM-A9 processor system (PS) into a single unit. The ARM Cortex-A9 CPUs, which also have on-chip memory, external memory interfaces, and a wide range of peripheral connectivity interfaces, constitute the PS's brains.

 

XC7Z035-2FFG676I Features

  • High-bandwidth connectivity within PS and between PS and PL

  • ARM AMBA® AXI based

  • QoS support on critical masters for latency and bandwidth control

  • 32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)

  • 512 KB 8-way set-associative Level 2 cache (shared between the CPUs)

  • Byte-parity support

  • On-chip boot ROM

  • 256 KB on-chip RAM (OCM)

  • Byte-parity support

 

XC7Z035-2FFG676I Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


Product Availability Disclaimer

Product information on this page is provided for identification and sourcing reference purposes. A product listing does not indicate that VEMEKO currently holds physical inventory of the listed part number. Availability, manufacturer, source, date code, packaging, condition and lead time are confirmed separately at the quotation stage.

Trademark Notice

AMD, Xilinx, Zynq, Kintex, Virtex and other related trademarks are the property of Advanced Micro Devices, Inc. or its affiliates. VEMEKO is an independent electronic component sourcing company and is not represented as an authorized distributor of AMD unless expressly stated and documented for a specific transaction.

XC7Z035-2FFG676I Specifications

SpecificationValue
CategoryEmbedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 275K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Base Product NumberXC7Z035


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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