The XC7Z035-3FBG676E is based on the Xilinx SoC architecture. These products combine a 28 nm Xilinx programmable logic (PL) chip and a feature-rich dual-core or single-core ARM Cortex-A9 processor system (PS) into a single unit. The ARM Cortex-A9 CPUs, which also have on-chip memory, external memory interfaces, and a wide range of peripheral connectivity interfaces, constitute the PS's brains.
The speed grades of the XC7Z035-3FBG676E is -3, -2, -2LI, -1, and -1LQ, with -3 having the best performance. The XC7Z035-3FBG676E is screened for lower maximum static power and run at programmable logic (PL) VCCINT/VCCBRAM = 0.95V. A -2LI device's speed specification is the same as a -2 device's. The XC7Z035-3FBG676E is screened for lower power and run at the same voltage and speed. The DC and AC characteristics of the XC7Z035-3FBG676E is described in the commercial, extended, industrial, and expanded (Q-temp) temperature ranges.
| Specification | Value |
|---|---|
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex?-7 FPGA, 275K Logic Cells |
| Operating Temperature | 0℃ ~ 100℃ (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
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