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Home > Product > Xilinx, Inc > Zynq-7000 SoC
XC7Z035-3FFG900E

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XC7Z035-3FFG900E

Manufacturer:
Xilinx
Package/Case:
FCBGA-900
RoHS:
Lifecycle:
Active
Stock Resource:
Factory Excess Stock / Franchised Distributor
Datasheet:
XC7Z035-3FFG900E
Product Categories:
Embedded - System On Chip (SoC)
Description:
Integrated Circuits (ICs) Embedded System On Chip (SoC) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Zynq®-7000 275K Logic Cells 256KB 900-FCBGA
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XC7Z035-3FFG900E Overview

The Vemeko Part Number for this integrated circuit (IC), which belongs to the Zynq-7000 series, is 1124939-XC7Z035-3FFG900E. A dual ARM Cortex-A9 MPCore with CoreSight core processor powers this system-on-chip (SoC). XC7Z035-3FFG900E has a tray packaging and an 800MHz speed. CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG are among the connectivity choices. This product has 130 I/O and peripherals like DMA. XC7Z035-3FFG900E has a Kintex-7 FPGA with 275K logic cells and 256KB of RAM. This item has a 900-BBGA, FCBGA package/case and an MCU and FPGA architecture. Its ECCN is 3A001A7B and its temperature range is 0°C to 100°C (TJ).

Custom software and logic can be implemented in the PL and PS using the Zynq-7000 architecture. XC7Z035-3FFG900E enables the execution of distinctive and differentiating system functions. Due to their constrained I/O bandwidth, latency, and power budgets, two-chip systems (such as an ASSP with an FPGA) cannot achieve the performance levels possible with the PS and PL integrated together.

 

XC7Z035-3FFG900E Features

  • Multiprotocol dynamic memory controller

  • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories

  • ECC support in 16-bit mode

  • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide memories

  • Static memory interfaces

  • 8-bit SRAM data bus with up to 64 MB support

  • Parallel NOR flash support

  • ONFI1.0 NAND flash support (1-bit ECC)

  • 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit) serial NOR flash

 

XC7Z035-3FFG900E Applications

  • Automotive driver assistance, driver information, and infotainment

  • Broadcast camera

  • Industrial motor control, industrial networking, and machine vision

  • IP and Smart camera

  • LTE radio and baseband

  • Medical diagnostics and imaging

  • Multifunction printers

  • Video and night vision equipment


XC7Z035-3FFG900E Specifications

SpecificationValue
CategoryIntegrated Circuits (ICs) Embedded System On Chip (SoC)
MfrAMD
SeriesZynq®-7000
PackageTray
Product StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 275K Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)
Number of I/O130
Base Product NumberXC7Z035


Application Field

  • AI

    Artificial Intelligence

  • 5G Technology

    5G Technology

  • Cloud Computing

    Cloud Computing

  • Consumer Electronics

    Consumer Electronics

  • Wireless

    Wireless Technology

  • Industrial Control

    Industrial Control

  • Internet of Things

    Internet of Things

  • Medical Equipment

    Medical Equipment

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