XC7Z045-1FBG676C

XC7Z045-1FBG676C Overview

A frequently used component of the XC7Z045 family, created by Xilinx Inc., is the XC7Z045-1FBG676C. It adheres to ECCN 3A991.d and was released on March 23, 2012. It is mounted using SMD technology and operates in a temperature range of -40°C to 100°C (TJ). It features 166 I/O and an operational supply voltage range of 2.375 V to 2.625 V. The XC7Z045-1FBG676C features 15552 logic cells, 3456 LABs/CLBs, and 98304 total RAM bits. The 240-BFQFP exposed pad package is available.

When using a single rank configuration of 8-bit, 16-bit, or 32-bit DRAM memories, the multi-protocol DDR memory controller can be set up to offer accesses that are 16-bit or 32-bit wide to a 1 GB address space. When using 16-bit bus access mode, ECC is supported. The DDR controller, along with the corresponding PHY and its own set of specialized I/Os, are both integrated within the PS. For DDR3, a speed of up to 1333 Mb/s is supported.

XC7Z045-1FBG676C Features

• 32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)

• 512 KB 8-way set-associative Level 2 cache (shared between the CPUs)

• Byte-parity support

• High-bandwidth connectivity within PS and between PS and PL

• ARM AMBA® AXI based

• QoS support on critical masters for latency and bandwidth control

XC7Z045-1FBG676C Applications

• Flat Panel Displays

• Set-Top Boxes

• Wireless Access

• Industrial Ethernet and Motion Control

• Automotive

• Multi-function Printers

• Multi-Axis Motor Control

• Machine Vision

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XC7Z045-1FBG676C Specifications