This AMD Xilinx XC7Z045-1FBG676CES is an embedded FPGA integrated circuit designed for low-end computing applications. The manufacturer has put this system on a chip as 676-BBGA, FCBGA. XC7Z045-1FBG676CES offers dependable operation thanks to its 256KB RAM implementation. For its internal architecture, the SoC design uses MCU and FPGA architecture. The series name of this system on chip SoC is Zynq-7000. The recommended operating temperatures for this SoC meaning are 0°C to 85°C TJ.It is crucial to keep in mind that this SoC security comprises 350K Logic Cells with Kintex-7 FPGA. Modern Tray packaging was used in the design of this system-on-chip (SoC). This SoC component has 130 total I/Os.Use a power source with a value of 1V is often recommended.
If the voltage is more than 1.05V, the SoCs wireless is regarded as unstable.It need to be able to operate as long as it receives a power source that is at least 0.95V.676 terminations are advantageous for a system on a chip.You will receive a system on chip with the same features and functions as XC7Z045.The wireless SoC operates at a frequency of 667MHz. Its primary architecture is ARM.
Two controllers that are SD/SDIO 2.0/MMC3.31 compliant
three peripheral chip choices and two full-duplex SPI ports
Two UARTs with high speed (up to 1 Mb/s)
two I2C interfaces, both master and slave
GPIO has four 32-bit banks, of which the PS I/O can utilize up to 54 bits (one bank of 32 bits and one bank of 22 bits) and the Programmable Logic can use up to 64 bits (up to two banks of 32 bits).
Up to 54 flexible multiplexed I/O (MIO) pin assignments for peripheral devices
Support for essential masters using ARM AMBA® AXI-based high-bandwidth communication for latency and bandwidth management inside PS and between PS and PL
ADAS
Medical Endoscope
Small Cell Baseband
Professional Cameras
Flat Panel Displays
Set-Top Boxes
Wireless Access
Industrial Ethernet and Motion Control
Specification | Value |
Category | Embedded System On Chip (SoC) |
Mfr | AMD |
Series | Zynq®-7000 |
Package | Tray |
Product Status | Obsolete |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 667MHz |
Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
Operating Temperature | 0°C ~ 85°C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27x27) |
Number of I/O | 130 |
Base Product Number | XC7Z045 |
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