XC7Z045-1FBG676I

XC7Z045-1FBG676I Overview

This XC7Z045-1FBG676I's packaging/case is designated as 676-BBGA, FCBGA, and the supplier device package is designated as 676-FCBGA (27x27). Its operational temperature range (TJ) is -40 to 100 degrees Celsius. This XC7Z045-1FBG676I's ECCN is 3A991D, and its open market fake threat percentage is 75%. The MSL level is 4 (for the next 72 hours), and REACH is in an unaffected state. This component's HTSUS is 8542.39.0001, and AMD Xilinx is the company that makes it.

Custom software and logic can be implemented in the PL and PS using the Zynq-7000 architecture. XC7Z045-1FBG676I enables the execution of distinctive and differentiating system functions. Due to their constrained I/O bandwidth, latency, and power budgets, two-chip systems (such as an ASSP with an FPGA) cannot achieve the performance levels possible with the PS and PL integrated together.

XC7Z045-1FBG676I Features

• 2.5 DMIPS/MHz per CPU

• CPU frequency: Up to 1 GHz

• Coherent multiprocessor support

• ARMv7-A architecture

• TrustZone® security

• Thumb®-2 instruction set

• Jazelle® RCT execution Environment Architecture

• NEON™ media-processing engine

• Single and double precision Vector Floating Point Unit (VFPU)

• CoreSight™ and Program Trace Macrocell (PTM)

• Timer and Interrupts

• Three watchdog timers

• One global timer

• Two triple-timer counters

XC7Z045-1FBG676I Applications

• Automotive driver assistance, driver information, and infotainment

• Broadcast camera

• Industrial motor control, industrial networking, and machine vision

• IP and Smart camera

• LTE radio and baseband

• Medical diagnostics and imaging

• Multifunction printers

• Video and night vision equipment

XC7Z045-1FBG676I Specifications